Inventor · disambiguated record
Hirofumi Moroe
Also filed as: MOROE HIROFUMI
7 granted patents·395 citations·filing 1997–2001
88Inventor score
Files withSHINKAWA KK7
Top patents by PatentIndex Score
7 records- 0195US6687988B1Method for forming pin-form wires and the likeSHINKAWA KK·Filed 2000·Granted Feb 10, 2004·115 cites·4 claims
- 0295US6581283B2Method for forming pin-form wires and the likeSHINKAWA KK·Filed 2000·Granted Jun 24, 2003·113 cites·4 claims
- 0385US5953624ABump forming methodSHINKAWA KK·Filed 1998·Granted Sep 14, 1999·116 cites·2 claims
- 0466US5848868AWafer conveying apparatusSHINKAWA KK·Filed 1997·Granted Dec 15, 1998·36 cites·3 claims
- 0546US6505823B2Apparatus for positioning a semiconductor pelletSHINKAWA KK·Filed 2001·Granted Jan 14, 2003·2 cites·2 claims
- 0644US6193130B1Bump bonding apparatusSHINKAWA KK·Filed 1999·Granted Feb 27, 2001·12 cites·6 claims
- 0730US6632703B2Method and apparatus for positioning a semiconductor pelletSHINKAWA KK·Filed 1999·Granted Oct 14, 2003·1 cites·1 claims
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