Inventor · disambiguated record
Lance Cole Wright
Also filed as: WRIGHT LANCE · WRIGHT LANCE C · WRIGHT LANCE COLE
20 granted patents·4 pending applications·60 citations·filing 1998–2024
93Inventor score
Top patents by PatentIndex Score
24 records- 0191US9171830B2Fabricating a proximity sensor having light-blocking structure in leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Oct 27, 2015·8 cites·5 claims
- 0289US11177197B2Semiconductor package with solder standoffTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 16, 2021·5 cites·24 claims
- 0388US8304871B2Exposed die package for direct surface mountingYU FRANK·Filed 2011·Granted Nov 6, 2012·13 cites·16 claims
- 0483US8470644B2Exposed die package for direct surface mountingTEXAS INSTRUMENTS INC·Filed 2012·Granted Jun 25, 2013·7 cites·4 claims
- 0582US9515059B2Proximity sensor having light-blocking structure in leadframe and method of making sameTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 6, 2016·3 cites·5 claims
- 0681US11658130B2Conductive plate stress reduction featureTEXAS INSTRUMENTS INC·Filed 2020·Granted May 23, 2023·1 cites·30 claims
- 0772US8816513B2Electronic assembly with three dimensional inkjet printed tracesROMIG MATTHEW DAVID·Filed 2012·Granted Aug 26, 2014·4 cites·15 claims
- 0870US9608158B2Proximity sensor having light-blocking structure in leadframe and method of making sameTEXAS INSTRUMENTS INC·Filed 2016·Granted Mar 28, 2017·1 cites·3 claims
- 0970US8945986B2Electronic assembly with three dimensional inkjet printed tracesTEXAS INSTRUMENTS INC·Filed 2014·Granted Feb 3, 2015·2 cites·7 claims
- 1069US11908780B2Semiconductor package with solder standoffTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 20, 2024·0 cites·24 claims
- 1165US8994154B2Proximity sensor having light blocking structure in leadframeTEXAS INSTRUMENTS INC·Filed 2013·Granted Mar 31, 2015·1 cites·3 claims
- 1265US8847349B2Integrated circuit package with printed circuit layerTEXAS INSTRUMENTS INC·Filed 2012·Granted Sep 30, 2014·2 cites·1 claims
- 1357US7320903B2Apparatus for and method of packaging semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 22, 2008·1 cites·4 claims
- 1457US2025309084A1Semiconductor packages with compact lead designTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1554US9111845B2Integrated circuit package with printed circuit layerTEXAS INSTRUMENTS INC·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 1653US6774485B2Apparatus for and method of packaging semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2001·Granted Aug 10, 2004·5 cites·6 claims
- 1746US9899339B2Discrete device mounted on substrateTEXAS INSTRUMENTS INC·Filed 2012·Granted Feb 20, 2018·0 cites·9 claims
- 1844US7061108B2Semiconductor device and a method for securing the device in a carrier tapeTEXAS INSTRUMENTS INC·Filed 2003·Granted Jun 13, 2006·3 cites·3 claims
- 1940US6977191B2Apparatus for and method of packaging semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2004·Granted Dec 20, 2005·0 cites·4 claims
- 2037US2006170080A1Semiconductor device having directly attached heat spreaderZUNIGA-ORTIZ EDGAR R·Filed 2005·Application pending·0 cites
- 2133US2008290481A1Semiconductor Device Package LeadframeKUDOH TAKAHIKO·Filed 2007·Application pending·0 cites
- 2231US6042247AEfficient hybrid illuminatorTEXAS INSTRUMENTS INC·Filed 1998·Granted Mar 28, 2000·2 cites·20 claims
- 2331US2004227216A1Flex resistant semiconductor die pad, leadframe, and packageFiled 2004·Application pending·0 cites
- 2430US6292580B1Efficient illumination system for wire bondersTEXAS INSTRUMENTS INC·Filed 1998·Granted Sep 18, 2001·2 cites·20 claims
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