Inventor · disambiguated record
Yasuo Kadoya
Also filed as: KADOYA YASUO
6 granted patents·6 pending applications·5 citations·filing 2013–2023
69Inventor score
Top patents by PatentIndex Score
12 records- 0188US10035221B2Metal bonded product and method for producing metal bonded productORIGIN ELECTRIC·Filed 2015·Granted Jul 31, 2018·4 cites·4 claims
- 0271US11484965B2Method for manufacturing joined member and apparatus for manufacturing the sameORIGIN ELECTRIC·Filed 2019·Granted Nov 1, 2022·0 cites·5 claims
- 0367US9849539B2Bonded article and method for manufacturing bonded articleORIGIN ELECTRIC·Filed 2015·Granted Dec 26, 2017·1 cites·9 claims
- 0461US2025205837A1Insert manufacturing apparatus, method of manufacturing insert, insert for cutting tool, and baseORIGIN CO LTD·Filed 2023·Application pending·0 cites
- 0556US2023080587A1Joining device and method for manufacturing joined objectORIGIN CO LTD·Filed 2021·Application pending·0 cites
- 0648US2018104762A1Method for manufacturing joined member and apparatus for manufacturing the sameORIGIN ELECTRIC·Filed 2016·Application pending·0 cites
- 0747US10350699B2Method for manufacturing joined member and joined member manufacturing apparatusORIGIN ELECTRIC·Filed 2017·Granted Jul 16, 2019·0 cites·7 claims
- 0847US9434021B2Capacitive welder and method for charging sameORIGIN ELECTRIC·Filed 2013·Granted Sep 6, 2016·0 cites·15 claims
- 0946US2016046067A1Composite material joining device, method for manufacturing joined body, and joined bodyORIGIN ELECTRIC·Filed 2014·Application pending·0 cites
- 1045US10005149B2Capacitor-type welding device and capacitor-type welding methodORIGIN ELECTRIC·Filed 2013·Granted Jun 26, 2018·0 cites·18 claims
- 1143US2020030907A1Method for manufacturing dissimilar metals-joined article and joining apparatusORIGIN CO LTD·Filed 2018·Application pending·0 cites
- 1237US2023053736A1Joining device and method for manufacturing joined objectORIGIN CO LTD·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →