Inventor · disambiguated record

Tzung Shiou Tsai

Also filed as: TSAI TZUNG SHIOU

1 granted patent·4 citations·filing 2014–2014

24Inventor score

Technology areasH10W

Files withADVANCED SEMICONDUCTOR ENG1

Top patents by PatentIndex Score

1 record

0167US10032652B2Semiconductor package having improved package-on-package interconnectionADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jul 24, 2018·4 cites·19 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →