Inventor · disambiguated record
Dan Shier
Also filed as: SHIER DAN
2 granted patents·31 citations·filing 2000–2002
63Inventor score
Technology areasH05K
Files withINTEL CORP2
Top patents by PatentIndex Score
2 records- 0176US6395995B1Apparatus for coupling integrated circuit packages to bonding pads having viasINTEL CORP·Filed 2000·Granted May 28, 2002·22 cites·15 claims
- 0260US7036712B2Methods to couple integrated circuit packages to bonding pads having viasINTEL CORP·Filed 2002·Granted May 2, 2006·9 cites·19 claims
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