Inventor · disambiguated record
Manabu Horita
Also filed as: HORITA MANABU
3 granted patents·39 citations·filing 1993–2016
68Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0162US10192811B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jan 29, 2019·1 cites·18 claims
- 0260US5500502ABonding method and apparatusMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Mar 19, 1996·30 cites·17 claims
- 0355US6614101B2Lead frame with raised leads and plastic packaged semiconductor device using the sameMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Sep 2, 2003·8 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →