Inventor · disambiguated record
Shalabh Tandon
Also filed as: TANDON SHALABH
5 granted patents·12 citations·filing 2004–2016
72Inventor score
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0180US9659908B1Systems and methods for package on package through mold interconnectsINTEL CORP·Filed 2015·Granted May 23, 2017·4 cites·20 claims
- 0279US9953934B2Warpage controlled package and method for sameINTEL CORP·Filed 2015·Granted Apr 24, 2018·4 cites·35 claims
- 0358US7518091B2Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted materialINTEL CORP·Filed 2006·Granted Apr 14, 2009·1 cites·6 claims
- 0448US7119314B2Radio frequency and microwave radiation used in conjunction with convective thermal heating to expedite curing of an imprinted materialINTEL CORP·Filed 2004·Granted Oct 10, 2006·3 cites·15 claims
- 0540US11276625B2Methods of forming flexure based cooling solutions for package structuresINTEL CORP·Filed 2016·Granted Mar 15, 2022·0 cites·25 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →