Inventor · disambiguated record
Youngsuk Kim
Also filed as: KIM YOUNGSUK
58 granted patents·16 pending applications·243 citations·filing 2010–2024
98Inventor score
Top patents by PatentIndex Score
74 records- 0199US12288682B2Processing method of waferDISCO CORP·Filed 2022·Granted Apr 29, 2025·8 cites·15 claims
- 0298US9828715B2Laundry maching having a drying functionLG ELECTRONICS INC·Filed 2016·Granted Nov 28, 2017·17 cites·19 claims
- 0398US9194073B2Laundry machine having a drying functionLG ELECTRONICS INC·Filed 2014·Granted Nov 24, 2015·23 cites·27 claims
- 0498US8800165B2Laundry machine having a drying functionKWON IG GEUN·Filed 2010·Granted Aug 12, 2014·35 cites·32 claims
- 0596US9163352B2Laundry treatment apparatusLG ELECTRONICS INC·Filed 2014·Granted Oct 20, 2015·17 cites·13 claims
- 0696US9027256B2Laundry lint filter cleaning machineKIM YOUNGSUK·Filed 2013·Granted May 12, 2015·42 cites·11 claims
- 0796US8997377B2Clothes treatment apparatus and method for controlling a clothes treatment apparatusLG ELECTRONICS INC·Filed 2012·Granted Apr 7, 2015·26 cites·17 claims
- 0894US9683325B2Clothes treating apparatusLG ELECTRONICS INC·Filed 2015·Granted Jun 20, 2017·8 cites·20 claims
- 0994US9200837B2Laundry machine having a drying functionLG ELECTRONICS INC·Filed 2014·Granted Dec 1, 2015·9 cites·22 claims
- 1093US9677215B2Laundry treating apparatusLG ELECTRONICS INC·Filed 2015·Granted Jun 13, 2017·7 cites·16 claims
- 1193US9255353B2Laundry machine having a drying functionKWON IG GEUN·Filed 2014·Granted Feb 9, 2016·9 cites·19 claims
- 1292US9279211B2Laundry treatment apparatusLG ELECTRONICS INC·Filed 2014·Granted Mar 8, 2016·10 cites·20 claims
- 1391US9290885B2Laundry treatment apparatusLG ELECTRONICS INC·Filed 2014·Granted Mar 22, 2016·8 cites·20 claims
- 1491US9200838B2Laundry machine having a drying functionLG ELECTRONICS INC·Filed 2014·Granted Dec 1, 2015·6 cites·24 claims
- 1587US11164802B2Wafer manufacturing method and multilayer device chip manufacturing methodDISCO CORP·Filed 2020·Granted Nov 2, 2021·2 cites·7 claims
- 1681US11935863B2Laser reflow apparatus and laser reflow methodDISCO CORP·Filed 2020·Granted Mar 19, 2024·1 cites·19 claims
- 1780US10937668B2Semiconductor package manufacturing methodDISCO CORP·Filed 2019·Granted Mar 2, 2021·3 cites·9 claims
- 1877US10403520B2Multi-blade and processing method of workpieceDISCO CORP·Filed 2018·Granted Sep 3, 2019·3 cites·3 claims
- 1977US9803306B2Clothes treatment apparatus and a method for controlling a clothes treatment apparatusLG ELECTRONICS INC·Filed 2012·Granted Oct 31, 2017·3 cites·14 claims
- 2076US2024402432A1Diffraction light guide plate and manufacturing method thereofLG CHEMICAL LTD·Filed 2024·Application pending·0 cites
- 2174US11576314B2Plant cultivating apparatusLG ELECTRONICS INC·Filed 2019·Granted Feb 14, 2023·1 cites·20 claims
- 2271US10707176B2Method of manufacturing semiconductor packageDISCO CORP·Filed 2018·Granted Jul 7, 2020·1 cites·6 claims
- 2371US9909249B2Laundry treating apparatusLG ELECTRONICS INC·Filed 2015·Granted Mar 6, 2018·1 cites·9 claims
- 2470US10700014B2Method of manufacturing semiconductor packageDISCO CORP·Filed 2017·Granted Jun 30, 2020·1 cites·14 claims
- 2567US11183464B2Package substrate processing method and protective tapeDISCO CORP·Filed 2018·Granted Nov 23, 2021·1 cites·14 claims
- 2666US10211164B2Semiconductor package manufacturing methodDISCO CORP·Filed 2017·Granted Feb 19, 2019·1 cites·3 claims
- 2766US2023090909A1Processing method and processing apparatus for workpieceDISCO CORP·Filed 2022·Application pending·0 cites
- 2861US12104057B2Curable composition and optical material comprising cured product thereofLG CHEMICAL LTD·Filed 2020·Granted Oct 1, 2024·0 cites·16 claims
- 2959US2021294041A1Diffraction light guide plate and manufacturing method thereofLG CHEMICAL LTD·Filed 2020·Application pending·0 cites
- 3059US2022192115A1Plant cultivation apparatusLG ELECTRONICS INC·Filed 2021·Application pending·0 cites
- 3159US2024071827A1Dividing method of waferDISCO CORP·Filed 2023·Application pending·0 cites
- 3258US12441843B2Diffraction light guide plate and manufacturing method thereofLG CHEMICAL LTD·Filed 2020·Granted Oct 14, 2025·0 cites·9 claims
- 3358US11590629B2Method of processing workpiece and resin sheet unitDISCO CORP·Filed 2019·Granted Feb 28, 2023·0 cites·20 claims
- 3458US11528858B2Plant cultivating apparatusLG ELECTRONICS INC·Filed 2019·Granted Dec 20, 2022·0 cites·17 claims
- 3558US2023178734A1Negative Electrode for Secondary Battery, Method of Manufacturing the Same, and Lithium Secondary Battery Including the SameLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 3657US12474217B2Inspection methodDISCO CORP·Filed 2023·Granted Nov 18, 2025·0 cites·4 claims
- 3757US2023298938A1Wafer processing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 3857US2023249283A1Processing systemDISCO CORP·Filed 2023·Application pending·0 cites
- 3956US2022192106A1Plant cultivation apparatusLG ELECTRONICS INC·Filed 2021·Application pending·0 cites
- 4055US11764115B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·16 claims
- 4154US12300545B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted May 13, 2025·0 cites·18 claims
- 4254US11854891B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Dec 26, 2023·0 cites·19 claims
- 4354US11764114B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 19, 2023·0 cites·17 claims
- 4454US11756831B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Sep 12, 2023·0 cites·19 claims
- 4553US12317653B2Method of manufacturing LED display panelDISCO CORP·Filed 2022·Granted May 27, 2025·0 cites·2 claims
- 4653US12065544B2Curable composition and optical element comprising cured product thereofLG CHEMICAL LTD·Filed 2019·Granted Aug 20, 2024·0 cites·8 claims
- 4753US11607771B2Wafer processing apparatusDISCO CORP·Filed 2020·Granted Mar 21, 2023·0 cites·14 claims
- 4852US12198990B2Wafer manufacturing method and laminated device chip manufacturing methodDISCO CORP·Filed 2021·Granted Jan 14, 2025·0 cites·12 claims
- 4950US11133198B2Method of manufacturing packaged device chipDISCO CORP·Filed 2020·Granted Sep 28, 2021·0 cites·6 claims
- 5050US10586699B2Method of assessing semiconductor substrate and method of assessing device chipDISCO CORP·Filed 2018·Granted Mar 10, 2020·0 cites·7 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →