Inventor · disambiguated record

Byoung Ho Jung

Also filed as: JUNG BYOUNG HO

1 granted patent·1 pending application·0 citations·filing 2020–2022

1Inventor score

Technology areasH10P

Files withSEMES CO LTD2

Top patents by PatentIndex Score

2 records

0141US12334381B2Guide unit, transfer assembly and die bonding apparatus including the sameSEMES CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·8 claims
0238US2021020483A1Die pickup methodSEMES CO LTD·Filed 2020·Application pending·0 cites

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