Inventor · disambiguated record

Yeon Hyuk Jung

Also filed as: JUNG YEON HYUK

1 granted patent·0 citations·filing 2022–2022

1Inventor score

Technology areasH10P

Files withSEMES CO LTD1

Top patents by PatentIndex Score

1 record

0141US12334381B2Guide unit, transfer assembly and die bonding apparatus including the sameSEMES CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·8 claims

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