Inventor · disambiguated record
Hong-Sik Hwang
Also filed as: HWANG HONG-SIK
2 granted patents·3 pending applications·6 citations·filing 2006–2011
51Inventor score
Top patents by PatentIndex Score
5 records- 0170US7749340B2Technique for increasing the compliance of lead-free solders containing silverINDIUM CORP AMERICA·Filed 2006·Granted Jul 6, 2010·4 cites·28 claims
- 0264US7749336B2Technique for increasing the compliance of tin-indium soldersINDIUM CORP AMERICA·Filed 2006·Granted Jul 6, 2010·2 cites·7 claims
- 0351US2007256761A1Alloy compositions and techniques for reducing intermetallic compound thickness and oxidation of metals and alloysINDIUM CORP AMERICA·Filed 2007·Application pending·0 cites
- 0450US2011273847A1Alloy compositions and techniques for reducing intermetallic compound thicknesses and oxidation of metals and alloysHWANG HONG-SIK·Filed 2011·Application pending·0 cites
- 0543US2007071634A1Low melting temperature compliant soldersINDIUM CORP AMERICA·Filed 2006·Application pending·0 cites
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