Inventor · disambiguated record

Tee Onn Chong

Also filed as: CHONG TEE ONN

2 granted patents·76 citations·filing 1999–2001

67Inventor score

Technology areasH05K H10W

Files withINTEL CORP2

Top patents by PatentIndex Score

2 records

0187US6664483B2Electronic package with high density interconnect and associated methodsINTEL CORP·Filed 2001·Granted Dec 16, 2003·53 cites·34 claims
0256US6362438B1Enhanced plated-through hole and via contact designINTEL CORP·Filed 1999·Granted Mar 26, 2002·23 cites·13 claims

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Tee Onn Chong — Patent Inventor | PatentIndex