Inventor · disambiguated record
Jihwan Woo
Also filed as: WOO JIHWAN
8 granted patents·2 pending applications·2 citations·filing 2019–2020
72Inventor score
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0175US11368719B2Method and device for encoding three-dimensional image, and method and device for decoding three-dimensional imageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 21, 2022·2 cites·14 claims
- 0256US12367889B2Method and apparatus for transmitting/receiving voice signal on basis of artificial neural networkSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 22, 2025·0 cites·16 claims
- 0354US12217464B2Three-dimensional data encoding method and device, and three-dimensional data decoding method and deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 4, 2025·0 cites·11 claims
- 0452US11328453B2Device and method for image processingSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 10, 2022·0 cites·20 claims
- 0551US11317074B2Method and apparatus for processing data for three-dimensional imageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 26, 2022·0 cites·8 claims
- 0647US11887342B2Method and device for encoding three-dimensional image, and method and device for decoding three-dimensional imageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 30, 2024·0 cites·16 claims
- 0745US10853910B2Method and apparatus for processing omni-directional imageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 0843US2022028119A1Method, device, and computer-readable recording medium for compressing 3d mesh contentSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 0942US11430185B2Method and apparatus for processing three-dimensional dataSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 30, 2022·0 cites·12 claims
- 1042US2022084253A1Method and device for compressing three-dimensional data, and method and device for reconstructing three-dimensional dataSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →