Inventor · disambiguated record

Steffi Thierbach

Also filed as: THIERBACH STEFFI

1 granted patent·4 citations·filing 2008–2008

24Inventor score

Technology areasH10W

Files withLEHR MATTHIAS1

Top patents by PatentIndex Score

1 record

0164US8283247B2Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bondingLEHR MATTHIAS·Filed 2008·Granted Oct 9, 2012·4 cites·18 claims

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