Inventor · disambiguated record
Toshiki Okui
Also filed as: OKUI TOSHIKI
13 granted patents·2 pending applications·90 citations·filing 1997–2006
90Inventor score
Top patents by PatentIndex Score
15 records- 0183US6838229B2Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the sameTOKYO OHKA KOGYO CO LTD·Filed 2002·Granted Jan 4, 2005·22 cites·21 claims
- 0281US6641972B2Positive photoresist composition for the formation of thick films, photoresist film and method of forming bumps using the sameTOKYO OHKA KOGYO CO LTD·Filed 2002·Granted Nov 4, 2003·21 cites·6 claims
- 0379US7063934B2Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the sameTOYKO OHKA KOGYO CO LTD·Filed 2002·Granted Jun 20, 2006·15 cites·8 claims
- 0478US7419769B2Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the sameTOKYO OHKA KOGYO CO LTD·Filed 2005·Granted Sep 2, 2008·4 cites·6 claims
- 0568US7132213B2Positive photoresist composition and method of forming resist patternTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Nov 7, 2006·9 cites·4 claims
- 0661US7169532B2Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminalTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Jan 30, 2007·6 cites·12 claims
- 0759US9436084B2Positive-working photoresist composition for thick film formationMISUMI KOICHI·Filed 2006·Granted Sep 6, 2016·1 cites·5 claims
- 0853US7081327B2Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminalTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Jul 25, 2006·3 cites·11 claims
- 0947US7129018B2Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the sameTOYKO OHKA KOGYO CO LTD·Filed 2005·Granted Oct 31, 2006·2 cites·6 claims
- 1042US5908734AImage formation method with a post exposure heating stepTOKYO OHKA KOGYO CO LTD·Filed 1997·Granted Jun 1, 1999·7 cites·7 claims
- 1139US7951522B2Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminalTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted May 31, 2011·0 cites·9 claims
- 1239US7927778B2Chemically amplified positive photoresist composition for thick film, thick-film photoresist laminated product, manufacturing method for thick-film resist pattern, and manufacturing method for connection terminalTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Apr 19, 2011·0 cites·19 claims
- 1339US7462436B2Positive photoresist composition and method of forming resist patternTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Dec 9, 2008·0 cites·9 claims
- 1436US2003087187A1Thick film photoresist layer laminate, method of manufacturing thick film resist pattern, and method of manufacturing connecting terminalTOKYO OHKA KOGYO CO LTD·Filed 2002·Application pending·0 cites
- 1531US2006183048A1Positive photoresist composition and resist pattern formationMASUDA YASUO·Filed 2004·Application pending·0 cites
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