Inventor · disambiguated record
Melvin Martin
Also filed as: MARTIN MELVIN · MARTIN MELVIN D
6 granted patents·3 pending applications·27 citations·filing 1991–2021
77Inventor score
Top patents by PatentIndex Score
9 records- 0185US10636742B2Very thin embedded trace substrate-system in package (SIP)DIALOG SEMICONDUCTOR UK LTD·Filed 2017·Granted Apr 28, 2020·4 cites·16 claims
- 0273US11075167B2Pillared cavity down MIS-SIPDIALOG SEMICONDUCTOR UK LTD·Filed 2019·Granted Jul 27, 2021·2 cites·3 claims
- 0365US10410996B2Integrated circuit package for assembling various dice in a single IC packageDIALOG SEMICONDUCTOR UK LTD·Filed 2016·Granted Sep 10, 2019·2 cites·20 claims
- 0458US11532489B2Pillared cavity down MIS-SiPDIALOG SEMICONDUCTOR UK LTD·Filed 2021·Granted Dec 20, 2022·0 cites·15 claims
- 0558US11309255B2Very thin embedded trace substrate-system in package (SIP)DIALOG SEMICONDUCTOR UK LTD·Filed 2020·Granted Apr 19, 2022·0 cites·14 claims
- 0649US5229051AMethod for making sleeve encased concrete postsPERMA POST INTERNATIONAL INC·Filed 1991·Granted Jul 20, 1993·19 cites·1 claims
- 0738US2014355215A1Embedded Heat Slug to Enhance Substrate Thermal ConductivityDIALOG SEMICONDUCTOR GMBH·Filed 2013·Application pending·0 cites
- 0834US2019259689A1Re-Routable Clip for Leadframe Based ProductDIALOG SEMICONDUCTOR UK LTD·Filed 2018·Application pending·0 cites
- 0932US2018025965A1WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded Component on Leadframe and Method ThereforDIALOG SEMICONDUCTOR UK LTD·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →