Inventor · disambiguated record
Nobuo Aoi
Also filed as: AOI NOBUO
48 granted patents·18 pending applications·946 citations·filing 1990–2017
98Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD38PANASONIC CORP16SOFSERA CORP5AOI NOBUO3IKEDA ATSUSHI1
Top patents by PatentIndex Score
66 records- 0197US5989998AMethod of forming interlayer insulating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Nov 23, 1999·254 cites·8 claims
- 0295US6387824B1Method for forming porous forming film wiring structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 14, 2002·80 cites·4 claims
- 0393US6558756B2Method of forming interlayer insulating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 6, 2003·42 cites·4 claims
- 0492US7060323B2Method of forming interlayer insulating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 13, 2006·38 cites·2 claims
- 0590US6242339B1Interconnect structure and method for forming the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Jun 5, 2001·76 cites·8 claims
- 0686US7663239B2Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2005·Granted Feb 16, 2010·12 cites·20 claims
- 0785US6455436B1Method of fabricating semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Sep 24, 2002·31 cites·5 claims
- 0884US8941238B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted Jan 27, 2015·7 cites·15 claims
- 0984US6319854B1Method of forming porous film and material for porous filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Nov 20, 2001·26 cites·20 claims
- 1082US8937368B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted Jan 20, 2015·6 cites·19 claims
- 1182US6602802B2Method of forming a porous film on a substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 5, 2003·20 cites·13 claims
- 1281US6458720B1Method for forming interlayer dielectric filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Oct 1, 2002·21 cites·10 claims
- 1379US11504452B2Ceramic particle composite materialSOFSERA CORP·Filed 2017·Granted Nov 22, 2022·2 cites·10 claims
- 1478US6873052B2Porous, film, wiring structure, and method of forming the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Mar 29, 2005·15 cites·14 claims
- 1578US6545361B2Semiconductor device having multilevel interconnection structure and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 8, 2003·23 cites·4 claims
- 1675US6242336B1Semiconductor device having multilevel interconnection structure and method for fabricating the sameMATSUSHITA ELECTRONICS CORP·Filed 1998·Granted Jun 5, 2001·41 cites·14 claims
- 1775US5084125AApparatus and method for producing semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1990·Granted Jan 28, 1992·57 cites·10 claims
- 1873US6333257B1Interconnection structure and method for forming the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Dec 25, 2001·11 cites·2 claims
- 1972US7648908B2Method for forming inlaid interconnectPANASONIC CORP·Filed 2008·Granted Jan 19, 2010·4 cites·9 claims
- 2069US7291919B2Interlayer dielectric film, and method for forming the same and interconnectionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 6, 2007·2 cites·5 claims
- 2167US6232237B1Method for fabricating semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted May 15, 2001·31 cites·7 claims
- 2265US6287973B2Method for forming interconnection structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Sep 11, 2001·11 cites·8 claims
- 2365US6197696B1Method for forming interconnection structureMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Mar 6, 2001·28 cites·15 claims
- 2463US7659626B2Semiconductor device including a barrier metal filmPANASONIC CORP·Filed 2005·Granted Feb 9, 2010·2 cites·5 claims
- 2561US9917066B2Semiconductor device having stacked chips, a re-distribution layer, and penetration electrodesPANASONIC CORP·Filed 2014·Granted Mar 13, 2018·1 cites·22 claims
- 2660US7893535B2Semiconductor device and method for fabricating the samePANASONIC CORP·Filed 2009·Granted Feb 22, 2011·1 cites·8 claims
- 2760US7816267B2Method for forming inlaid interconnectPANASONIC CORP·Filed 2009·Granted Oct 19, 2010·1 cites·5 claims
- 2860US5877080AMethod of manufacturing semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Mar 2, 1999·24 cites·18 claims
- 2957US5942802ASemiconductor device and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Aug 24, 1999·16 cites·5 claims
- 3055US2009042403A1Method for fabricating semiconductor device and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 3154US11168031B2Calcium phosphate sintered particles and production method thereforSOFSERA CORP·Filed 2017·Granted Nov 9, 2021·0 cites·20 claims
- 3253US6903006B2Interlayer dielectric film, and method for forming the same and interconnectionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 7, 2005·3 cites·14 claims
- 3352US5863834ASemiconductor device and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Jan 26, 1999·18 cites·6 claims
- 3451US7396778B2Method for synthesizing polymeric material, method for forming polymer thin film and method for forming interlayer insulating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 8, 2008·0 cites·14 claims
- 3551US6200912B1Semiconductor device and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Mar 13, 2001·12 cites·4 claims
- 3651US2007191585A1Organic polymer film and method for forming the sameAOI NOBUO·Filed 2007·Application pending·0 cites
- 3750US7960489B2Interlayer insulating film, method for forming the same and polymer compositonPANASONIC CORP·Filed 2007·Granted Jun 14, 2011·0 cites·4 claims
- 3850US2006286815A1Interlayer insulating film formation method and film structure of interlayer insulating filmAOI NOBUO·Filed 2006·Application pending·0 cites
- 3950US2006286816A1Method for fabricating semiconductor device and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 4050US2006226121A1Etching methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 4149US7947375B2Interlayer dielectric filmPANASONIC CORP·Filed 2007·Granted May 24, 2011·0 cites·16 claims
- 4249US7232874B2Interlayer insulating film, method for forming the same and polymer compositionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 19, 2007·2 cites·7 claims
- 4349US6171979B1Semiconductor device and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jan 9, 2001·11 cites·3 claims
- 4448US2009266590A1Interconnect structure and method for fabricating the samePANASONIC CORP·Filed 2009·Application pending·0 cites
- 4547US7691453B2Method for forming organic/inorganic hybrid insulation filmPANASONIC CORP·Filed 2004·Granted Apr 6, 2010·1 cites·12 claims
- 4646US2005234157A1Precursor solution for organic polymer film formation and method for forming organic polymer filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 4745US7947338B2Method of forming an interlayer insulating film having a siloxane skeletonPANASONIC CORP·Filed 2006·Granted May 24, 2011·0 cites·4 claims
- 4844US7696627B2Multilayered interconnect structure and method for fabricating the samePANASONIC CORP·Filed 2006·Granted Apr 13, 2010·0 cites·2 claims
- 4944USRE38753EInterconnect structure and method for forming the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jul 5, 2005·0 cites·8 claims
- 5044US6194029B1Method of forming porous film and material for porous filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 27, 2001·8 cites·11 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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