Inventor · disambiguated record
Hyoung Min Im
Also filed as: IM HYOUNG MIN
2 granted patents·1 pending application·0 citations·filing 2016–2024
22Inventor score
Technology areasH10W
Files withSK HYNIX INC3
Top patents by PatentIndex Score
3 records- 0156US2024321770A1Semiconductor package including shield layer and method of manufacturing the sameSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0241US11018094B2Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packagesSK HYNIX INC·Filed 2019·Granted May 25, 2021·0 cites·7 claims
- 0332US9875990B2Semiconductor package including planar stacked semiconductor chipsSK HYNIX INC·Filed 2016·Granted Jan 23, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →