Inventor · disambiguated record
Toshihiro Maki
Also filed as: MAKI TOSHIHIRO
26 granted patents·1 pending application·622 citations·filing 1988–2004
97Inventor score
Top patents by PatentIndex Score
27 records- 0192US5418071ASputtering target and method of manufacturing the sameTOSHIBA KK·Filed 1993·Granted May 23, 1995·67 cites·21 claims
- 0291USD316703SHousing for an electrical connectorYAZAKI CORP·Filed 1988·Granted May 7, 1991·39 cites·1 claims
- 0387US6749457B2Crimp terminalYAZAKI CORP·Filed 2002·Granted Jun 15, 2004·39 cites·3 claims
- 0486US6329275B1Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the sameTOSHIBA KK·Filed 1996·Granted Dec 11, 2001·76 cites·6 claims
- 0583US5470527ATi-W sputtering target and method for manufacturing sameTOSHIBA KK·Filed 1994·Granted Nov 28, 1995·53 cites·14 claims
- 0681USD316704SHousing for an electrical connectorYAZAKI CORP·Filed 1988·Granted May 7, 1991·21 cites·1 claims
- 0780US5196916AHighly purified metal material and sputtering target using the sameTOSHIBA KK·Filed 1991·Granted Mar 23, 1993·54 cites·36 claims
- 0875US6976889B2Method and structure for connecting a terminal with a wireYAZAKI CORP·Filed 2004·Granted Dec 20, 2005·16 cites·5 claims
- 0975US5913100AMo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin filmTOSHIBA KK·Filed 1994·Granted Jun 15, 1999·40 cites·8 claims
- 1070US6626711B2Press-clamping terminal and method of examining press-clamped condition thereofYAZAKI CORP·Filed 2001·Granted Sep 30, 2003·19 cites·9 claims
- 1166US7153589B1Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin filmTOSHIBA KK·Filed 1998·Granted Dec 26, 2006·18 cites·11 claims
- 1266US6352628B2Refractory metal silicide target, method of manufacturing the target, refractory metal silicide thin film, and semiconductor deviceTOSHIBA KK·Filed 2001·Granted Mar 5, 2002·8 cites·5 claims
- 1365US5458697AHighly purified metal material and sputtering target using the sameTOSHIBA KK·Filed 1994·Granted Oct 17, 1995·28 cites·23 claims
- 1464US6893301B2Method and structure for connecting a terminal with a wireYAZAKI CORP·Filed 2003·Granted May 17, 2005·10 cites·2 claims
- 1564US6200694B1Mo-W material for formation of wiring, Mo-W target and method for production thereof, and Mo-W wiring thin filmTOSHIBA KK·Filed 1998·Granted Mar 13, 2001·23 cites·12 claims
- 1663US5679983AHighly purified metal material and sputtering target using the sameTOSHIBA KK·Filed 1995·Granted Oct 21, 1997·22 cites·3 claims
- 1762US6734359B2Wire connecting structure and connecting methodYAZAKI CORP·Filed 2002·Granted May 11, 2004·12 cites·5 claims
- 1862US6625884B1Method of determining a connection state of metal terminal and a wireYAZAKI CORP·Filed 2000·Granted Sep 30, 2003·8 cites·6 claims
- 1960US6770817B2Structure for waterproofing terminal-wire connecting portion and method of waterproofing the sameYAZAKI CORP·Filed 2002·Granted Aug 3, 2004·10 cites·4 claims
- 2057US6309593B1Refractory metal silicide target, method of manufacturing the target, refractory metal silicide thin film, and semiconductor deviceTOSHIBA KK·Filed 1994·Granted Oct 30, 2001·15 cites·5 claims
- 2157USD324205SConnector housingYAZAKI CORP·Filed 1989·Granted Feb 25, 1992·7 cites·1 claims
- 2255US5634825AElectrical terminalYAZAKI CORP·Filed 1995·Granted Jun 3, 1997·16 cites·6 claims
- 2353US6739899B2Method and structure for connecting a terminal with a wireYAZAKI CORP·Filed 2002·Granted May 25, 2004·3 cites·3 claims
- 2449US6113441AMetal terminal and wire connectorYAZAKI CORP·Filed 1998·Granted Sep 5, 2000·10 cites·6 claims
- 2539USRE41975EInterconnector line of thin film, sputter target for forming the wiring film and electronic component using the sameTOSHIBA KK·Filed 1996·Granted Nov 30, 2010·6 cites·34 claims
- 2639US2004157505A1Structure for waterproofing terminal-wire connecting portion and method of waterproofing the sameYAZAKI CORP·Filed 2004·Application pending·0 cites
- 2731USRE45481EInterconnector line of thin film, sputter target for forming the wiring film and electronic component using the sameISHIGAMI TAKASHI·Filed 1996·Granted Apr 21, 2015·2 cites·27 claims
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