Inventor · disambiguated record
Yu Lung Lam
Also filed as: LAM YU LUNG
2 granted patents·2 pending applications·0 citations·filing 2012–2018
23Inventor score
Top patents by PatentIndex Score
4 records- 0136US10475666B2Routable electroforming substrate comprising removable carrierASM TECH SINGAPORE PTE LTD·Filed 2018·Granted Nov 12, 2019·0 cites·15 claims
- 0235US9847468B1Plated lead frame including doped silver layerASM TECH SINGAPORE PTE LTD·Filed 2016·Granted Dec 19, 2017·0 cites·9 claims
- 0330US2013098659A1Pre-plated lead frame for copper wire bondingKWAN YIU FAI·Filed 2012·Application pending·0 cites
- 0417US2016204003A1Method of forming asper-silver on a lead frameKWAN YIU FAI·Filed 2015·Application pending·0 cites
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