Inventor · disambiguated record
Steven M. Mcdonald
Also filed as: MCDONALD STEVEN M
33 granted patents·1 pending application·804 citations·filing 1996–2007
98Inventor score
Top patents by PatentIndex Score
34 records- 0197US7603772B2Methods of fabricating substrates including one or more conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 20, 2009·41 cites·16 claims
- 0297US6169021B1Method of making a metallized recess in a substrateMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 2, 2001·253 cites·39 claims
- 0394US6046094AMethod of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 4, 2000·105 cites·28 claims
- 0490US6884642B2Wafer-level testing apparatus and methodMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 26, 2005·38 cites·25 claims
- 0589US6744067B1Wafer-level testing apparatus and methodMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 1, 2004·34 cites·11 claims
- 0687US7329899B2Wafer-level redistribution circuitMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 12, 2008·9 cites·10 claims
- 0787US6121133AIsolation using an antireflective coatingMICRON TECHNOLOGY INC·Filed 1997·Granted Sep 19, 2000·57 cites·7 claims
- 0881US7316063B2Methods of fabricating substrates including at least one conductive viaMICRON TECHNOLOGY INC·Filed 2004·Granted Jan 8, 2008·21 cites·16 claims
- 0981US6495450B1Isolation using an antireflective coatingMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 17, 2002·17 cites·39 claims
- 1080US7594322B2Methods of fabricating substrates including at least one conductive viaMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 29, 2009·6 cites·17 claims
- 1180US7105921B2Semiconductor assemblies having electrophoretically insulated viasMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 12, 2006·4 cites·13 claims
- 1280US7105437B2Methods for creating electrophoretically insulated vias in semiconductive substratesMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 12, 2006·4 cites·20 claims
- 1380US6174590B1Isolation using an antireflective coatingMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 16, 2001·37 cites·18 claims
- 1480US5700732ASemiconductor wafer, wafer alignment patterns and method of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1996·Granted Dec 23, 1997·37 cites·9 claims
- 1578US6423631B1Isolation using an antireflective coatingMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 23, 2002·14 cites·47 claims
- 1677US6455212B1Method for providing an alignment diffraction grating for photolithographic alignment during semiconductor fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 24, 2002·10 cites·18 claims
- 1776US7030010B2Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structuresMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 18, 2006·12 cites·87 claims
- 1873US7498670B2Semiconductor structures having electrophoretically insulated viasMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 3, 2009·2 cites·15 claims
- 1973US7470590B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 30, 2008·5 cites·10 claims
- 2073US6605502B2Isolation using an antireflective coatingMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 12, 2003·10 cites·27 claims
- 2171US5925937ASemiconductor wafer, wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 20, 1999·23 cites·2 claims
- 2267US6635396B2Method for providing an alignment diffraction grating for photolithographic alignment during semiconductor fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 21, 2003·5 cites·16 claims
- 2365US6605516B2Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patternsFiled 2001·Granted Aug 12, 2003·7 cites·6 claims
- 2459US6482572B1Method for providing an alignment diffraction grating for photolithographic alignment during semiconductor fabricationMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 19, 2002·3 cites·17 claims
- 2555US7335981B2Methods for creating electrophoretically insulated vias in semiconductive substratesMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 26, 2008·0 cites·9 claims
- 2655US6777144B2Method for patterning a photoresist material for semiconductor component fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 17, 2004·2 cites·17 claims
- 2755US6573013B2Method for providing an alignment diffraction grating for photolithographic alignment during semiconductor fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 3, 2003·2 cites·18 claims
- 2853US6137186ASemiconductor wafer, wafer alignment patterns and method of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1998·Granted Oct 24, 2000·10 cites·18 claims
- 2951US2006254808A1Substrate precursor structuresFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 3050US6248429B1Metallized recess in a substrateMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 19, 2001·12 cites·26 claims
- 3148US7115512B2Methods of forming semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 3, 2006·2 cites·32 claims
- 3247US6313650B1Insert testing systemMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 6, 2001·10 cites·24 claims
- 3347US5798292AMethod of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 25, 1998·7 cites·27 claims
- 3442US6207529B1Semiconductor wafer,wafer alignment patterns and method of forming wafer alignment patternsMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 27, 2001·5 cites·19 claims
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