Inventor · disambiguated record
Mitsuo Usami
Also filed as: USAMI MITSUO
74 granted patents·7 pending applications·2,633 citations·filing 1988–2010
99Inventor score
Top patents by PatentIndex Score
81 records- 0197US5870289AChip connection structure having diret through-hole connections through adhesive film and wiring substrateHITACHI LTD·Filed 1995·Granted Feb 9, 1999·488 cites·33 claims
- 0296US5067007ASemiconductor device having leads for mounting to a surface of a printed circuit boardHITACHI LTD·Filed 1991·Granted Nov 19, 1991·360 cites·11 claims
- 0393US6922686B2Database integration management method and apparatus and processing program, medium thereforHITACHI LTD·Filed 2001·Granted Jul 26, 2005·121 cites·11 claims
- 0493US6342434B1Methods of processing semiconductor wafer, and producing IC card, and carrierHITACHI LTD·Filed 1996·Granted Jan 29, 2002·136 cites·4 claims
- 0591US7061083B1Semiconductor devicesHITACHI LTD·Filed 1999·Granted Jun 13, 2006·117 cites·2 claims
- 0691US6589855B2Methods of processing semiconductor wafer and producing IC card, and carrierHITACHI LTD·Filed 2001·Granted Jul 8, 2003·57 cites·19 claims
- 0790US5423209ATruncated pyramid-shape multi-hole pitot probe and flight velocity detection system using said truncated pyramid-shape multi-hole pitot probeNAT AEROSPACE LAB OF SCIENCE A·Filed 1994·Granted Jun 13, 1995·96 cites·11 claims
- 0889US7201328B2Semiconductor devices and manufacturing method therefor and electric commerce method and transponder readerHITACHI LTD·Filed 2006·Granted Apr 10, 2007·15 cites·17 claims
- 0989US5909052ASemiconductor device having plural chips with the sides of the chips in face-to-face contact with each other in the same crystal planeHITACHI LTD·Filed 1995·Granted Jun 1, 1999·101 cites·32 claims
- 1088US7298029B2Semiconductor devices and manufacturing method thereforHITACHI LTD·Filed 2005·Granted Nov 20, 2007·15 cites·10 claims
- 1188US5237214AHigh speed logic circuit and semiconductor integrated circuit device including variable impedance to provide reduced power consumptionHITACHI LTD·Filed 1992·Granted Aug 17, 1993·50 cites·37 claims
- 1288US5206546ALogic circuit including variable impedance meansHITACHI LTD·Filed 1991·Granted Apr 27, 1993·52 cites·32 claims
- 1387US7119662B1Service system, information processing system and interrogatorHITACHI LTD·Filed 2000·Granted Oct 10, 2006·51 cites·12 claims
- 1486US7157050B2System and method for detecting biological and chemical materialHITACHI LTD·Filed 2003·Granted Jan 2, 2007·27 cites·17 claims
- 1586US6291877B1Flexible IC chip between flexible substratesHITACHI LTD·Filed 2000·Granted Sep 18, 2001·35 cites·27 claims
- 1685US7459341B2Method of manufacturing an electronic deviceHITACHI LTD·Filed 2006·Granted Dec 2, 2008·10 cites·7 claims
- 1785US7036741B2Semiconductor devices and manufacturing method therefor and electronic commerce method and transponder readerHITACHI LTD·Filed 2003·Granted May 2, 2006·35 cites·6 claims
- 1884US7159241B1Method for the determination of soundness of a sheet-shaped medium, and method for the verification of data of a sheet-shaped mediumHITACHI LTD·Filed 2000·Granted Jan 2, 2007·46 cites·14 claims
- 1984US6573158B2Methods of processing semiconductor wafer and producing IC card, and carrierHITACHI LTD·Filed 2001·Granted Jun 3, 2003·29 cites·18 claims
- 2082US6617172B2Semiconductor device having identification number, manufacturing method thereof and electronic deviceHITACHI LTD·Filed 2001·Granted Sep 9, 2003·28 cites·21 claims
- 2181US6440773B1Semiconductor deviceHITACHI LTD·Filed 1997·Granted Aug 27, 2002·62 cites·24 claims
- 2280US6657542B2Electronic device and method of manufacture the sameHITACHI LTD·Filed 2001·Granted Dec 2, 2003·19 cites·44 claims
- 2380US6588672B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Jul 8, 2003·55 cites·32 claims
- 2479US7256739B2Antenna for radio frequency identificationHITACHI LTD·Filed 2004·Granted Aug 14, 2007·26 cites·18 claims
- 2579US7051205B1Sheet-shaped medium, method and apparatus for determination of genuineness or counterfeitness of the same, and apparatus for issuing certificateHITACHI LTD·Filed 2000·Granted May 23, 2006·26 cites·4 claims
- 2677US6486541B2Semiconductor device and fabrication methodHITACHI LTD·Filed 2001·Granted Nov 26, 2002·17 cites·26 claims
- 2776US6660557B2Method of manufacturing an electronic deviceHITACHI LTD·Filed 2001·Granted Dec 9, 2003·17 cites·22 claims
- 2876US6051877ASemiconductor device and fabrication methodHITACHI LTD·Filed 1997·Granted Apr 18, 2000·36 cites·34 claims
- 2975US7503507B2Wireless IC tag and manufacturing method of the sameHITACHI LTD·Filed 2006·Granted Mar 17, 2009·6 cites·7 claims
- 3075US6140697ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 31, 2000·35 cites·21 claims
- 3174US7800200B2Wireless IC tag and method for manufacturing sameHITACHI LTD·Filed 2005·Granted Sep 21, 2010·6 cites·6 claims
- 3274US7309019B2Method of checking authenticity of sheet with built-in electronic circuit chipHITACHI LTD·Filed 2006·Granted Dec 18, 2007·3 cites·6 claims
- 3372US5986341ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Nov 16, 1999·31 cites·55 claims
- 3471US5214318ASemiconductor integrated circuit device having a signal transmission line pair interconnected by propagation delay time control resistanceHITACHI LTD·Filed 1991·Granted May 25, 1993·26 cites·13 claims
- 3570US8174368B2Reading method, responder, and interrogatorUSAMI MITSUO·Filed 2009·Granted May 8, 2012·4 cites·16 claims
- 3670US6841871B2Semiconductor device utilizing pads of different sizes connected to an antennaHITACHI LTD·Filed 2001·Granted Jan 11, 2005·14 cites·12 claims
- 3770US6659353B1Method of checking authenticity of sheet with built-in electronic circuit chipHITACHI LTD·Filed 1999·Granted Dec 9, 2003·31 cites·15 claims
- 3869US7863718B2Electronic tag chipHITACHI LTD·Filed 2005·Granted Jan 4, 2011·4 cites·3 claims
- 3968US6589818B2Method for mounting a thin semiconductor deviceHITACHI LTD·Filed 2002·Granted Jul 8, 2003·10 cites·4 claims
- 4068US6259158B1Semiconductor device utilizing an external electrode with a small pitch connected to a substrateHITACHI LTD·Filed 1996·Granted Jul 10, 2001·30 cites·9 claims
- 4168US5296755AHigh speed BI CMOS logic circuit and a semiconductor integrated circuit device using sameHITACHI LTD·Filed 1991·Granted Mar 22, 1994·21 cites·55 claims
- 4267US5689136ASemiconductor device and fabrication methodHITACHI LTD·Filed 1994·Granted Nov 18, 1997·27 cites·16 claims
- 4366US5208178AManufacturing a semiconductor integrated circuit device having on chip logic correctionHITACHI LTD·Filed 1991·Granted May 4, 1993·25 cites·45 claims
- 4465US8017441B2Method for manufacturing IC tag inletHIACHI LTD·Filed 2006·Granted Sep 13, 2011·2 cites·6 claims
- 4565US6930401B2Electronic device and method of manufacture the sameHITACHI LTD·Filed 2003·Granted Aug 16, 2005·8 cites·15 claims
- 4664US7007854B2Method of checking authenticity of sheet with built-in electronic circuit chipHITACHI RES INST·Filed 2003·Granted Mar 7, 2006·7 cites·6 claims
- 4764US6514796B2Method for mounting a thin semiconductor deviceHITACHI LTD·Filed 2000·Granted Feb 4, 2003·8 cites·19 claims
- 4862US7056769B2Method of manufacturing an electronic deviceHITACHI LTD·Filed 2003·Granted Jun 6, 2006·7 cites·19 claims
- 4962US6166911ASemiconductor integrated circuit card assemblyHITACHI LTD·Filed 1996·Granted Dec 26, 2000·28 cites·11 claims
- 5062US6162701ASemiconductor device and method for making sameHITACHI LTD·Filed 1999·Granted Dec 19, 2000·19 cites·31 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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