Inventor · disambiguated record
Francis J. Downes, Jr.
Also filed as: DOWNES JR FRANCIS J · DOWNES JR FRANCIS JOSEPH
17 granted patents·349 citations·filing 1991–2003
95Inventor score
Files withIBM17
Top patents by PatentIndex Score
17 records- 0195US6373717B1Electronic package with high density interconnect layerIBM·Filed 2000·Granted Apr 16, 2002·97 cites·16 claims
- 0285US6829823B2Method of making a multi-layered interconnect structureIBM·Filed 2002·Granted Dec 14, 2004·31 cites·25 claims
- 0381US6626196B2Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processingIBM·Filed 2001·Granted Sep 30, 2003·23 cites·17 claims
- 0480US5940729AMethod of planarizing a curved substrate and resulting structureIBM·Filed 1996·Granted Aug 17, 1999·41 cites·24 claims
- 0575US6176985B1Laminated electroplating rack and connection system for optimized platingIBM·Filed 1998·Granted Jan 23, 2001·29 cites·16 claims
- 0672US6720502B1Integrated circuit structureIBM·Filed 2000·Granted Apr 13, 2004·17 cites·12 claims
- 0762US6429384B1Chip C4 assembly improvement using magnetic force and adhesiveIBM·Filed 2000·Granted Aug 6, 2002·9 cites·19 claims
- 0860US6887779B2Integrated circuit structureIBM·Filed 2003·Granted May 3, 2005·8 cites·20 claims
- 0959US6348737B1Metallic interlocking structureIBM·Filed 2000·Granted Feb 19, 2002·8 cites·14 claims
- 1058US6569604B1Blind via formation in a photoimageable dielectric materialIBM·Filed 1999·Granted May 27, 2003·18 cites·22 claims
- 1157US6693031B2Formation of a metallic interlocking structureIBM·Filed 2002·Granted Feb 17, 2004·7 cites·18 claims
- 1257US6142361AChip C4 assembly improvement using magnetic force and adhesiveIBM·Filed 1999·Granted Nov 7, 2000·19 cites·19 claims
- 1348US6150255AMethod of planarizing a curved substrate and resulting structureIBM·Filed 1999·Granted Nov 21, 2000·11 cites·13 claims
- 1445US5939786AUniform plating of dendritesIBM·Filed 1996·Granted Aug 17, 1999·10 cites·5 claims
- 1543US6043150AMethod for uniform plating of dendritesIBM·Filed 1999·Granted Mar 28, 2000·9 cites·11 claims
- 1642US5994910AApparatus, and corresponding method, for stress testing wire bond-type semi-conductor chipsIBM·Filed 1998·Granted Nov 30, 1999·9 cites·19 claims
- 1728US5230782AElectrolytic process for reducing the organic content of an aqueous composition and apparatus thereforeIBM·Filed 1991·Granted Jul 27, 1993·3 cites·19 claims
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