Inventor · disambiguated record
Malavarayan Sankarasubramanian
Also filed as: Sankarasubramanian Malavarayan
5 granted patents·8 pending applications·1 citations·filing 2016–2024
62Inventor score
Top patents by PatentIndex Score
13 records- 0177US12040246B2Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2020·Granted Jul 16, 2024·1 cites·15 claims
- 0269US2024332112A1Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2024·Application pending·0 cites
- 0357US10995194B2Filled elastomers with improved thermal and mechanical propertiesHYDRIL USA DISTRIB LLC·Filed 2017·Granted May 4, 2021·0 cites·15 claims
- 0451US11887962B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Jan 30, 2024·0 cites·7 claims
- 0549US12183688B2Integrated circuit die package stiffeners of metal alloys having exceptionally high CTEINTEL CORP·Filed 2021·Granted Dec 31, 2024·0 cites·21 claims
- 0648US2023137877A1No-remelt solder enforcement jointINTEL CORP·Filed 2021·Application pending·0 cites
- 0743US11335616B2Substrate integrated inductor with composite magnetic resin layerINTEL CORP·Filed 2017·Granted May 17, 2022·0 cites·25 claims
- 0839US2017130060A1Powder coating compositions for reducing friction and wear in high temperature high pressure applicationsVETCO GRAY INC·Filed 2016·Application pending·0 cites
- 0938US2020203470A1Magnetic mold material inductors for electronic packagesINTEL CORP·Filed 2018·Application pending·0 cites
- 1036US2020013533A1Magnetic solder mask on package substrate above magnetic inductor arrayINTEL CORP·Filed 2018·Application pending·0 cites
- 1136US2020005983A1Magnetic encapsulant for package magnetic inductorsINTEL CORP·Filed 2018·Application pending·0 cites
- 1235US2019393112A1Encapsulant material containing fluorophores for in-situ visualization of stress in an organic packageNOFEN ELIZABETH·Filed 2018·Application pending·0 cites
- 1335US2020203067A1Magnetic core/shell particles for inductor arraysINTEL CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →