Inventor · disambiguated record
Paul W. Coteus
Also filed as: COTEUS PAUL · COTEUS PAUL W · COTEUS PAUL WILLIAM
212 granted patents·12 pending applications·6,589 citations·filing 1990–2022
99Inventor score
Top patents by PatentIndex Score
224 records- 0199US7692944B23-dimensional integrated circuit architecture, structure and method for fabrication thereofIBM·Filed 2008·Granted Apr 6, 2010·256 cites·15 claims
- 0299US6249227B1RFID integrated in electronic assetsINTERMEC IP CORP·Filed 1998·Granted Jun 19, 2001·443 cites·7 claims
- 0399US5528222ARadio frequency circuit and memory in thin flexible packageIBM·Filed 1994·Granted Jun 18, 1996·1.5k cites·29 claims
- 0498US7761687B2Ultrascalable petaflop parallel supercomputerIBM·Filed 2007·Granted Jul 20, 2010·136 cites·44 claims
- 0598US7555566B2Massively parallel supercomputerIBM·Filed 2002·Granted Jun 30, 2009·121 cites·1 claims
- 0698US7331796B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2006·Granted Feb 19, 2008·50 cites·7 claims
- 0797US10215504B2Flexible cold plate with enhanced flexibilityIBM·Filed 2015·Granted Feb 26, 2019·25 cites·16 claims
- 0897US8626957B2Collective network for computer structuresBLUMRICH MATTHIAS A·Filed 2011·Granted Jan 7, 2014·47 cites·6 claims
- 0997US8516409B2Implementing vertical die stacking to distribute logical function over multiple dies in through-silicon-via stacked semiconductor deviceCOTEUS PAUL W·Filed 2010·Granted Aug 20, 2013·41 cites·4 claims
- 1097US8004841B2Method and apparatus of water cooling several parallel circuit cards each containing several chip packagesIBM·Filed 2008·Granted Aug 23, 2011·66 cites·22 claims
- 1197US7832095B2Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·24 cites·3 claims
- 1297US7486513B2Method and apparatus for cooling an equipment enclosure through closed-loop liquid-assisted air cooling in combination with direct liquid coolingIBM·Filed 2007·Granted Feb 3, 2009·71 cites·14 claims
- 1397US7342789B2Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid coolingIBM·Filed 2006·Granted Mar 11, 2008·130 cites·15 claims
- 1496US9081501B2Multi-petascale highly efficient parallel supercomputerASAAD SAMEH·Filed 2011·Granted Jul 14, 2015·115 cites·41 claims
- 1596US8250133B2Massively parallel supercomputerBLUMRICH MATTHIAS A·Filed 2009·Granted Aug 21, 2012·33 cites·29 claims
- 1696US8001280B2Collective network for computer structuresIBM·Filed 2005·Granted Aug 16, 2011·56 cites·35 claims
- 1796US7948817B2Advanced memory device having reduced power and improved performanceIBM·Filed 2009·Granted May 24, 2011·51 cites·6 claims
- 1896US7665999B2Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier planeIBM·Filed 2008·Granted Feb 23, 2010·19 cites·3 claims
- 1996US7354277B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 8, 2008·20 cites·4 claims
- 2095US10631438B2Mechanically flexible cold plates for low power componentsIBM·Filed 2017·Granted Apr 21, 2020·10 cites·15 claims
- 2195US8667049B2Massively parallel supercomputerBLUMRICH MATTHIAS A·Filed 2012·Granted Mar 4, 2014·23 cites·20 claims
- 2295US8081473B2Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packagesCIPOLLA THOMAS M·Filed 2008·Granted Dec 20, 2011·52 cites·18 claims
- 2395US7836585B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 23, 2010·16 cites·3 claims
- 2495US7832094B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·16 cites·5 claims
- 2595US7823283B2Method of forming a land grid array interposerIBM·Filed 2008·Granted Nov 2, 2010·16 cites·8 claims
- 2695US7612621B2System for providing open-loop quadrature clock generationIBM·Filed 2007·Granted Nov 3, 2009·29 cites·12 claims
- 2795US7484966B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Feb 3, 2009·16 cites·1 claims
- 2895US7361025B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 22, 2008·16 cites·6 claims
- 2995US7305487B2Optimized scalable network switchIBM·Filed 2002·Granted Dec 4, 2007·66 cites·24 claims
- 3095US6292903B1Smart memory interfaceIBM·Filed 1998·Granted Sep 18, 2001·249 cites·16 claims
- 3195US5780925ALead frame package for electronic devicesIBM·Filed 1995·Granted Jul 14, 1998·222 cites·11 claims
- 3294US8659959B2Advanced memory device having improved performance, reduced power and increased reliabilityKIM KYU-HYOUN·Filed 2012·Granted Feb 25, 2014·16 cites·5 claims
- 3394US8307270B2Advanced memory device having improved performance, reduced power and increased reliabilityKIM KYU-HYOUN·Filed 2009·Granted Nov 6, 2012·27 cites·7 claims
- 3493US8037600B2Method of producing a land grid array interposer structureIBM·Filed 2008·Granted Oct 18, 2011·11 cites·7 claims
- 3593US7529895B2Method for prefetching non-contiguous data structuresIBM·Filed 2006·Granted May 5, 2009·31 cites·1 claims
- 3693US7474529B2Folded-sheet-metal heatsinks for closely packaged heat-producing devicesIBM·Filed 2006·Granted Jan 6, 2009·27 cites·4 claims
- 3793US6518794B2AC drive cross point adjust method and apparatusIBM·Filed 2001·Granted Feb 11, 2003·82 cites·6 claims
- 3892US10606692B2Error correction potency improvement via added burst beats in a dram access cycleIBM·Filed 2017·Granted Mar 31, 2020·8 cites·14 claims
- 3992US8485831B2Tall mezzanine connectorCIPOLLA THOMAS M·Filed 2011·Granted Jul 16, 2013·27 cites·25 claims
- 4092US7683725B2System for generating a multiple phase clockIBM·Filed 2007·Granted Mar 23, 2010·22 cites·6 claims
- 4192US7408798B23-dimensional integrated circuit architecture, structure and method for fabrication thereofIBM·Filed 2006·Granted Aug 5, 2008·16 cites·5 claims
- 4291US8549363B2Reliability and performance of a system-on-a-chip by predictive wear-out based activation of functional componentsCHER CHEN-YONG·Filed 2010·Granted Oct 1, 2013·19 cites·24 claims
- 4391US7715197B2Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)IBM·Filed 2008·Granted May 11, 2010·22 cites·19 claims
- 4491US5113565AApparatus and method for inspection and alignment of semiconductor chips and conductive lead framesIBM·Filed 1990·Granted May 19, 1992·171 cites·22 claims
- 4590US8359521B2Providing a memory device having a shared error feedback pinIBM·Filed 2008·Granted Jan 22, 2013·23 cites·18 claims
- 4690US7636262B2Synchronous memory having shared CRC and strobe pinIBM·Filed 2007·Granted Dec 22, 2009·23 cites·20 claims
- 4790US7452212B2Metalized elastomeric electrical contactsIBM·Filed 2005·Granted Nov 18, 2008·16 cites·1 claims
- 4890US6807125B2Circuit and method for reading data transfers that are sent with a source synchronous clock signalIBM·Filed 2002·Granted Oct 19, 2004·57 cites·8 claims
- 4990US5343366APackages for stacked integrated circuit chip cubesIBM·Filed 1992·Granted Aug 30, 1994·141 cites·39 claims
- 5089US11497143B2Mechanically flexible cold plates for low power componentsIBM·Filed 2020·Granted Nov 8, 2022·2 cites·3 claims
Showing the top 50 of 224 patent records by PatentIndex Score.
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