Inventor · disambiguated record
Kris V. Srikrishnan
Also filed as: SRIKRISHNAN KRIS V · SRIKRISHNAN KRIS VENKATRAMAN
24 granted patents·2 pending applications·2,526 citations·filing 1981–2006
98Inventor score
Top patents by PatentIndex Score
26 records- 0199US5882987ASmart-cut process for the production of thin semiconductor material filmsIBM·Filed 1997·Granted Mar 16, 1999·883 cites·25 claims
- 0298US7141853B2Method and structure for buried circuits and devicesIBM·Filed 2004·Granted Nov 28, 2006·385 cites·11 claims
- 0398US6759282B2Method and structure for buried circuits and devicesIBM·Filed 2001·Granted Jul 6, 2004·338 cites·20 claims
- 0492US4471405AThin film capacitor with a dual bottom electrode structureIBM·Filed 1983·Granted Sep 11, 1984·57 cites·9 claims
- 0591US7491588B2Method and structure for buried circuits and devicesIBM·Filed 2006·Granted Feb 17, 2009·17 cites·10 claims
- 0691US5920764AProcess for restoring rejected wafers in line for reuse as newIBM·Filed 1997·Granted Jul 6, 1999·163 cites·14 claims
- 0790US5897370AHigh aspect ratio low resistivity lines/vias by surface diffusionIBM·Filed 1996·Granted Apr 27, 1999·89 cites·2 claims
- 0890US4423087AThin film capacitor with a dual bottom electrode structureIBM·Filed 1981·Granted Dec 27, 1983·46 cites·3 claims
- 0989US7320918B2Method and structure for buried circuits and devicesIBM·Filed 2005·Granted Jan 22, 2008·14 cites·17 claims
- 1086US6326285B1Simultaneous multiple silicon on insulator (SOI) wafer productionIBM·Filed 2000·Granted Dec 4, 2001·44 cites·53 claims
- 1184US5731245AHigh aspect ratio low resistivity lines/vias with a tungsten-germanium alloy hard capIBM·Filed 1996·Granted Mar 24, 1998·52 cites·3 claims
- 1283US5485032AAntifuse element with electrical or optical programmingIBM·Filed 1994·Granted Jan 16, 1996·61 cites·18 claims
- 1382US5371047AChip interconnection having a breathable etch stop layerIBM·Filed 1992·Granted Dec 6, 1994·73 cites·4 claims
- 1479US5372652AAerosol cleaning methodIBM·Filed 1993·Granted Dec 13, 1994·66 cites·11 claims
- 1572US5389814AElectrically blowable fuse structure for organic insulatorsIBM·Filed 1994·Granted Feb 14, 1995·41 cites·7 claims
- 1669US5314840AMethod for forming an antifuse element with electrical or optical programmingIBM·Filed 1992·Granted May 24, 1994·38 cites·10 claims
- 1764US4493856ASelective coating of metallurgical features of a dielectric substrate with diverse metalsIBM·Filed 1982·Granted Jan 15, 1985·25 cites·19 claims
- 1863US5469981AElectrically blowable fuse structure manufacturing for organic insulatorsIBM·Filed 1994·Granted Nov 28, 1995·27 cites·8 claims
- 1962US5420069AMethod of making corrosion resistant, low resistivity copper for interconnect metal linesIBM·Filed 1992·Granted May 30, 1995·30 cites·2 claims
- 2062US2005261927A1System and method for valuing intellectual propertyBILAK MARK R·Filed 2004·Application pending·0 cites
- 2160US5877084AMethod for fabricating high aspect ratio low resistivity lines/vias by surface reactionIBM·Filed 1997·Granted Mar 2, 1999·17 cites·12 claims
- 2259US4622205AElectromigration lifetime increase of lead base alloysIBM·Filed 1985·Granted Nov 11, 1986·14 cites·12 claims
- 2358US5787098AComplete chip I/O test through low contact testing using enhanced boundary scanIBM·Filed 1996·Granted Jul 28, 1998·24 cites·6 claims
- 2446US5856026AHigh aspect ratio low resistivity lines/vias by surface diffusionIBM·Filed 1996·Granted Jan 5, 1999·9 cites·19 claims
- 2542US4839715AChip contacts without oxide discontinuitiesIBM·Filed 1987·Granted Jun 13, 1989·13 cites·21 claims
- 2642US2002194280A1Electronic mail system for generating a mail message to multiple recipients with multiple attention levelsIBM·Filed 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →