Inventor · disambiguated record
Toshiyuki Sawamura
Also filed as: SAWAMURA TOSHIYUKI
4 granted patents·2 pending applications·8 citations·filing 2016–2024
64Inventor score
Files withMITSUBISHI CHEM CORP6
Top patents by PatentIndex Score
6 records- 0193US10414653B2Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheetMITSUBISHI CHEM CORP·Filed 2018·Granted Sep 17, 2019·6 cites·12 claims
- 0285US10106413B2Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheetMITSUBISHI CHEM CORP·Filed 2016·Granted Oct 23, 2018·2 cites·12 claims
- 0358US2025019489A1Thermosetting resin composition, thermally conductive resin sheet, heat-dissipating layered product, heat-dissipating circuit board, semiconductor device and power moduleMITSUBISHI CHEM CORP·Filed 2024·Application pending·0 cites
- 0456US2024010814A1Resin composition, cured product sheet, composite molded body, and semiconductor deviceMITSUBISHI CHEM CORP·Filed 2023·Application pending·0 cites
- 0547US11834603B2Heat dissipation sheet, heat dissipation member, and semiconductor deviceMITSUBISHI CHEM CORP·Filed 2020·Granted Dec 5, 2023·0 cites·6 claims
- 0646US12264229B2Resin composition, resin cured product, and composite molded bodyMITSUBISHI CHEM CORP·Filed 2021·Granted Apr 1, 2025·0 cites·10 claims
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