Inventor · disambiguated record
Fu-Tai Liou
Also filed as: LIOU FU T · LIOU FU-TAI
73 granted patents·7 pending applications·1,768 citations·filing 1987–2022
99Inventor score
Files withSGS THOMSON MICROELECTRONICS35ST MICROELECTRONICS INC15UNITED MICROELECTRONICS CORP9VOLTAFIELD TECHNOLOGY CORP8FU NAI-CHUNG3
Top patents by PatentIndex Score
80 records- 0194US5130268AMethod for forming planarized shallow trench isolation in an integrated circuit and a structure formed therebySGS THOMSON MICROELECTRONICS·Filed 1991·Granted Jul 14, 1992·138 cites·10 claims
- 0292US4962414AMethod for forming a contact VIASGS THOMSON MICROELECTRONICS·Filed 1989·Granted Oct 9, 1990·103 cites·2 claims
- 0389US5410176AIntegrated circuit with planarized shallow trench isolationSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Apr 25, 1995·91 cites·16 claims
- 0487US6031293APackage-free bonding pad structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Feb 29, 2000·88 cites·19 claims
- 0587US4771014AProcess for manufacturing LDD CMOS devicesSGS THOMSON MICROELECTRONICS·Filed 1987·Granted Sep 13, 1988·52 cites·5 claims
- 0686US5108951AMethod for forming a metal contactSGS THOMSON MICROELECTRONICS·Filed 1990·Granted Apr 28, 1992·80 cites·19 claims
- 0784US5059554AMethod for forming polycrystalline silicon contactsSGS THOMSON MICROELECTRONICS·Filed 1989·Granted Oct 22, 1991·56 cites·4 claims
- 0883US9030199B2Magnetoresistance sensor and fabricating method thereofLIOU FU-TAI·Filed 2011·Granted May 12, 2015·6 cites·23 claims
- 0983US4886764AProcess for making refractory metal silicide cap for protecting multi-layer polycide structureSGS THOMSON MICROELECTRONICS·Filed 1989·Granted Dec 12, 1989·41 cites·15 claims
- 1081US6017790AMethod of manufacturing embedded dynamic random access memoryUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 25, 2000·42 cites·30 claims
- 1181US5162884AInsulated gate field-effect transistor with gate-drain overlap and method of making the sameSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Nov 10, 1992·99 cites·12 claims
- 1280US6111319AMethod of forming submicron contacts and vias in an integrated circuitST MICROELECTRONICS INC·Filed 1995·Granted Aug 29, 2000·51 cites·13 claims
- 1379US5658828AMethod for forming an aluminum contact through an insulating layerSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Aug 19, 1997·49 cites·18 claims
- 1478US5270254AIntegrated circuit metallization with zero contact enclosure requirements and method of making the sameSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Dec 14, 1993·51 cites·16 claims
- 1577US5462894AMethod for fabricating a polycrystalline silicon resistive load element in an integrated circuitSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Oct 31, 1995·37 cites·5 claims
- 1676US8749232B2Magnatoresistive sensing component and agnatoresistive sensing deviceFU NAI-CHUNG·Filed 2012·Granted Jun 10, 2014·4 cites·30 claims
- 1775US9335386B2Magnatoresistive component and magnatoresistive deviceVOLTAFIELD TECHNOLOGY CORP·Filed 2014·Granted May 10, 2016·3 cites·23 claims
- 1875US6033980AMethod of forming submicron contacts and vias in an integrated circuitST MICROELECTRONICS INC·Filed 1997·Granted Mar 7, 2000·40 cites·5 claims
- 1975US5841195ASemiconductor contact via structureST MICROELECTRONICS INC·Filed 1995·Granted Nov 24, 1998·45 cites·24 claims
- 2074US5371041AMethod for forming a contact/VIASGS THOMSON MICROELECTRONICS·Filed 1992·Granted Dec 6, 1994·45 cites·10 claims
- 2172US5847460ASubmicron contacts and vias in an integrated circuitST MICROELECTRONICS INC·Filed 1995·Granted Dec 8, 1998·36 cites·20 claims
- 2271US9651636B2Single-chip three-axis magnetic field sensing deviceVOLTAFIELD TECH CORP·Filed 2013·Granted May 16, 2017·3 cites·21 claims
- 2370US5124280ALocal interconnect for integrated circuitsSGS THOMSON MICROELECTRONICS·Filed 1991·Granted Jun 23, 1992·35 cites·10 claims
- 2469US5593921AMethod of forming viasSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Jan 14, 1997·37 cites·12 claims
- 2568US5057463AThin oxide structure and methodSGS THOMSON MICROELECTRONICS·Filed 1990·Granted Oct 15, 1991·42 cites·12 claims
- 2667US6140198AMethod of fabricating load resistorUNITED MICROELECTRONICS CORP·Filed 1998·Granted Oct 31, 2000·25 cites·22 claims
- 2766US9182458B2Magnetoresistive sensing deviceVOLTAFIELD TECHNOLOGY CORP·Filed 2013·Granted Nov 10, 2015·2 cites·19 claims
- 2866US5070391ASemiconductor contact via structure and methodSGS THOMSON MICROELECTRONICS·Filed 1990·Granted Dec 3, 1991·31 cites·17 claims
- 2965US9224939B2Tunneling magnetoresistance sensorVOLTAFIELD TECHNOLOGY CORP·Filed 2013·Granted Dec 29, 2015·1 cites·11 claims
- 3065US8629519B2Tunneling magnetoresistance sensorLEE CHIEN-MIN·Filed 2011·Granted Jan 14, 2014·2 cites·2 claims
- 3163US5371410AIntegrated circuit metallization with zero contact enclosure requirementsSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Dec 6, 1994·26 cites·8 claims
- 3262US9128141B2Magnatoresistive sensing device and method for fabricating the sameVOLTAFIELD TECHNOLOGY CORP·Filed 2012·Granted Sep 8, 2015·1 cites·19 claims
- 3361US9543509B2Magnatoresistive structure and method for forming the sameVOLTAFIELD TECH CORP·Filed 2013·Granted Jan 10, 2017·1 cites·9 claims
- 3460US6320254B1Plug structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 20, 2001·25 cites·11 claims
- 3558US5391520AMethod for forming local interconnect for integrated circuitsSGS THOMSON MICROELECTRONICS·Filed 1993·Granted Feb 21, 1995·22 cites·6 claims
- 3658US4978637ALocal interconnect process for integrated circuitsSGS THOMSON MICROELECTRONICS·Filed 1989·Granted Dec 18, 1990·20 cites·9 claims
- 3758US4802054AInput protection for an integrated circuitMOTOROLA INC·Filed 1987·Granted Jan 31, 1989·16 cites·2 claims
- 3857US5234852ASloped spacer for MOS field effect devices comprising reflowable glass layerSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Aug 10, 1993·27 cites·5 claims
- 3956US8988073B2Magnetoresistive sensorFU NAI-CHUNG·Filed 2011·Granted Mar 24, 2015·1 cites·14 claims
- 4056US5246883ASemiconductor contact via structure and methodSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Sep 21, 1993·22 cites·15 claims
- 4155US4981813APad oxide protect sealed interface isolation processSGS THOMSON MICROELECTRONICS·Filed 1988·Granted Jan 1, 1991·20 cites·2 claims
- 4253US4933304AMethod for reducing the surface reflectance of a metal layer during semiconductor processingSGS THOMSON MICROELECTRONICS·Filed 1988·Granted Jun 12, 1990·18 cites·10 claims
- 4352US6946343B2Manufacturing method of an integrated chipUNITED MICROELECTRONICS CORP·Filed 2003·Granted Sep 20, 2005·4 cites·5 claims
- 4452US5319245ALocal interconnect for integrated circuitsSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Jun 7, 1994·16 cites·9 claims
- 4551US5424571ASloped spacer for mos field effect devicesSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Jun 13, 1995·20 cites·3 claims
- 4649US5976969AMethod for forming an aluminum contactST MICROELECTRONICS INC·Filed 1997·Granted Nov 2, 1999·11 cites·7 claims
- 4749US5349229ALocal interconnect for integrated circuitsSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Sep 20, 1994·15 cites·4 claims
- 4847US7067917B2Gradient barrier layer for copper back-end-of-line technologyUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jun 27, 2006·1 cites·11 claims
- 4947US5847465AContacts for semiconductor devicesST MICROELECTRONICS INC·Filed 1995·Granted Dec 8, 1998·13 cites·10 claims
- 5046US6271137B1Method of producing an aluminum stacked contact/via for multilayerST MICROELECTRONICS INC·Filed 1993·Granted Aug 7, 2001·16 cites·10 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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