Inventor · disambiguated record
Bai-Cwo Feng
Also filed as: FENG BAI · FENG BAI C · FENG BAI-CWO
10 granted patents·1 pending application·560 citations·filing 1974–2007
92Inventor score
Top patents by PatentIndex Score
11 records- 0195US3976524APlanarization of integrated circuit surfaces through selective photoresist maskingIBM·Filed 1974·Granted Aug 24, 1976·70 cites·29 claims
- 0292US5081563AMulti-layer package incorporating a recessed cavity for a semiconductor chipIBM·Filed 1990·Granted Jan 14, 1992·246 cites·7 claims
- 0387US4038110APlanarization of integrated circuit surfaces through selective photoresist maskingIBM·Filed 1976·Granted Jul 26, 1977·54 cites·3 claims
- 0484US4022932AResist reflow method for making submicron patterned resist masksIBM·Filed 1975·Granted May 10, 1977·47 cites·7 claims
- 0582US4180604ATwo layer resist systemIBM·Filed 1977·Granted Dec 25, 1979·29 cites·8 claims
- 0679US3982943ALift-off method of fabricating thin films and a structure utilizable as a lift-off maskIBM·Filed 1974·Granted Sep 28, 1976·34 cites·16 claims
- 0774US4238559ATwo layer resist systemIBM·Filed 1978·Granted Dec 9, 1980·28 cites·12 claims
- 0866US4029562AForming feedthrough connections for multi-level interconnections metallurgy systemsIBM·Filed 1976·Granted Jun 14, 1977·24 cites·6 claims
- 0959US4204009ATwo layer resist systemIBM·Filed 1978·Granted May 20, 1980·17 cites·6 claims
- 1055US2010035044A1Article comprising an adhesion promoter coatingFENG BAI·Filed 2007·Application pending·0 cites
- 1148US4131497AMethod of manufacturing self-aligned semiconductor devicesIBM·Filed 1977·Granted Dec 26, 1978·11 cites·32 claims
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