Inventor · disambiguated record
Tomohiro Nomura
Also filed as: NOMURA TOMOHIRO
5 granted patents·7 pending applications·64 citations·filing 1991–2024
75Inventor score
Top patents by PatentIndex Score
12 records- 0182US5120370ACleaning processMORI SHINICHI·Filed 1991·Granted Jun 9, 1992·57 cites·7 claims
- 0272US8253524B2Coil winding system and method for fabricating molded coilNOMURA TOMOHIRO·Filed 2008·Granted Aug 28, 2012·6 cites·5 claims
- 0361US2025111532A1Image processing apparatus, image processing method, and programFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 0459US9247646B2Electronic component built-in substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 26, 2016·1 cites·7 claims
- 0553US2025104846A1Information processing apparatus, information processing method, and programFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 0653US2025099055A1Information processing apparatus, information processing method, and programFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 0750US8534590B2Coil winding system and method for fabricating molded coilNOMURA TOMOHIRO·Filed 2012·Granted Sep 17, 2013·0 cites·7 claims
- 0850US8434213B2Method for fabricating molded coilNOMURA TOMOHIRO·Filed 2012·Granted May 7, 2013·0 cites·3 claims
- 0943US2006223236A1Method of manufacturing flexible circuit substrateSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 1043US2006215377A1Flexible circuit substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 1142US2007141757A1Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structureSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 1235US2002083586A1Process for producing multilayer circuit boardFiled 2001·Application pending·0 cites
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