Inventor · disambiguated record
Tadahiro Yokozawa
Also filed as: YOKOZAWA TADAHIRO
3 granted patents·10 pending applications·14 citations·filing 1993–2015
62Inventor score
Top patents by PatentIndex Score
13 records- 0179US7918021B2Production of via hole in a flexible printed circuit board by applying a laser or punchUBE INDUSTRIES·Filed 2008·Granted Apr 5, 2011·8 cites·6 claims
- 0265US2009242411A1Polyimide-metal laminated body and polyimide circuit boardUBE INDUSTRIES·Filed 2009·Application pending·0 cites
- 0355US2008286538A1Polyimide-Metal Laminated Body and Polyimide Circuit BoardUBE INDUSTRIES·Filed 2005·Application pending·0 cites
- 0453US2015069012A1Polyimide film and wiring boardUBE INDUSTRIES·Filed 2014·Application pending·0 cites
- 0550US2010252309A1Polyimide film and wiring boardUBE INDUSTRIES·Filed 2008·Application pending·0 cites
- 0648US2012288621A1Polyimide film and wiring boardYAMAGUCHI HIROAKI·Filed 2012·Application pending·0 cites
- 0743US2010230142A1Method for manufacturing printed wiring boardUBE INDUSTRIES·Filed 2008·Application pending·0 cites
- 0837US2005162835A1Production of via hole in flexible circuit printable boardUBE INDUSTIRES LTD·Filed 2003·Application pending·0 cites
- 0935US2009266589A1Process for producing metal wiring boardUBE INDUSTRIES·Filed 2006·Application pending·0 cites
- 1033US5403520ANonlinear optical device and optical signal processing unitUBE INDUSTRIES·Filed 1993·Granted Apr 4, 1995·6 cites·13 claims
- 1131US2009211786A1Process for producing polyimide film with copper wiringBAMBA KEITA·Filed 2006·Application pending·0 cites
- 1231US2012308816A1Polyimide film, polyimide laminate comprising same, and polyimide/metal laminate comprising sameKOHAMA SHIN-ICHIRO·Filed 2011·Application pending·0 cites
- 1330US10149394B2Method for forming conductor layer, and method for producing multilayer wiring substrate using sameUBE INDUSTRIES·Filed 2015·Granted Dec 4, 2018·0 cites·14 claims
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