Inventor · disambiguated record
Chien-Hsiang Yu
Also filed as: YU CHIEN-HSIANG
10 granted patents·5 citations·filing 2019–2023
80Inventor score
Files withWINBOND ELECTRONICS CORP10
Top patents by PatentIndex Score
10 records- 0194US11737380B2Resistive random access memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 22, 2023·3 cites·6 claims
- 0291US11778932B2Resistive random access memory and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Oct 3, 2023·2 cites·10 claims
- 0376US12193344B2Method for manufacturing resistive random access memoryWINBOND ELECTRONICS CORP·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 0471US12063875B2Method for manufacturing resistive random access memory structureWINBOND ELECTRONICS CORP·Filed 2023·Granted Aug 13, 2024·0 cites·10 claims
- 0568US11978768B2Manufacturing method of semiconductor structureWINBOND ELECTRONICS CORP·Filed 2023·Granted May 7, 2024·0 cites·14 claims
- 0666US11764274B2Memory device having contact plugs with narrower and wider portionsWINBOND ELECTRONICS CORP·Filed 2021·Granted Sep 19, 2023·0 cites·9 claims
- 0763US11721720B2Semiconductor structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Aug 8, 2023·0 cites·7 claims
- 0858US12336175B2Memory device and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Jun 17, 2025·0 cites·18 claims
- 0957US11056564B2Method of manufacturing a memory deviceWINBOND ELECTRONICS CORP·Filed 2019·Granted Jul 6, 2021·0 cites·5 claims
- 1046US12027422B2Semiconductor structures and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jul 2, 2024·0 cites·16 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →