Inventor · disambiguated record
Ryoichi Oguro
Also filed as: OGURO RYOICHI
5 granted patents·3 pending applications·82 citations·filing 1991–2020
80Inventor score
Top patents by PatentIndex Score
8 records- 0162US5792333AMethod of surface-roughening treatment of copper foilCIRCUIT FOIL JAPAN·Filed 1997·Granted Aug 11, 1998·25 cites·21 claims
- 0258US5413838ABoth-side roughened copper foil with protection filmSUMITOMO BAKELITE CO·Filed 1993·Granted May 9, 1995·24 cites·27 claims
- 0354US5320919ACopper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the sameSUMITOMO BAKELITE CO·Filed 1991·Granted Jun 14, 1994·19 cites·26 claims
- 0445US5286330AMethod of producing copper-clad laminated boardSUMITOMO BAKELITE CO·Filed 1992·Granted Feb 15, 1994·14 cites·13 claims
- 0543US2012111613A1Copper foil with resistance layer, method of production of the same and laminated boardOGURO RYOICHI·Filed 2010·Application pending·0 cites
- 0642US11773501B2Method for producing electrolytic copper foilTEX TECH INC·Filed 2020·Granted Oct 3, 2023·0 cites·8 claims
- 0741US2012205146A1Heat-resistant copper foil and method of producing the same, circuit board, and copper-clad laminate and method of producing the sameOGURO RYOICHI·Filed 2010·Application pending·0 cites
- 0840US2013071755A1Surface treatment method for copper foil, surface-treated copper foil, and copper foil for negative electrode collector of lithium ion secondary batteryOGURO RYOICHI·Filed 2011·Application pending·0 cites
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