Inventor · disambiguated record
In Hyo Hwang
Also filed as: HWANG IN HYO
2 granted patents·3 pending applications·0 citations·filing 2021–2025
31Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0177US12374597B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·19 claims
- 0275US2025309039A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0365US12002731B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·18 claims
- 0453US2024096820A1Method for manufacturing semiconductor package using sacrificial layer and semiconductor package manufactured by using thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0552US2024079336A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →