Inventor · disambiguated record

Yuji Kosaku

Also filed as: KOSAKU YUJI

2 granted patents·49 citations·filing 1995–2002

64Inventor score

Technology areasH10W

Files withKAIJO KK2

Top patents by PatentIndex Score

2 records

0177US6715666B2Wire bonding method, method of forming bump and bumpKAIJO KK·Filed 2002·Granted Apr 6, 2004·38 cites·11 claims
0254USD381344SDisk carrierKAIJO KK·Filed 1995·Granted Jul 22, 1997·11 cites·1 claims

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Yuji Kosaku — Patent Inventor | PatentIndex