Inventor · disambiguated record
Shinobu Ishii
Also filed as: ISHII SHINOBU
3 granted patents·47 citations·filing 2002–2010
69Inventor score
Technology areasH10W
Files withKAIJO KK3
Top patents by PatentIndex Score
3 records- 0177US6715666B2Wire bonding method, method of forming bump and bumpKAIJO KK·Filed 2002·Granted Apr 6, 2004·38 cites·11 claims
- 0274US7748599B2Wire bonding method, wire bonding apparatus, and wire bonding control programKAIJO KK·Filed 2008·Granted Jul 6, 2010·8 cites·8 claims
- 0356US8042725B2Wire bonding method, wire bonding apparatus, and wire bonding control programKAIJO KK·Filed 2010·Granted Oct 25, 2011·1 cites·1 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →