Inventor · disambiguated record

Rei Imai

Also filed as: IMAI REI

2 granted patents·73 citations·filing 2002–2006

67Inventor score

Technology areasH10W

Files withKAIJO KK2

Top patents by PatentIndex Score

2 records

0190US7815095B2Wire loop, semiconductor device having same and wire bonding methodKAIJO KK·Filed 2006·Granted Oct 19, 2010·35 cites·12 claims
0277US6715666B2Wire bonding method, method of forming bump and bumpKAIJO KK·Filed 2002·Granted Apr 6, 2004·38 cites·11 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →