Inventor · disambiguated record
Young Gwan Ko
Also filed as: KO YOUNG GWAN
83 granted patents·46 pending applications·437 citations·filing 2001–2023
99Inventor score
Files withSAMSUNG ELECTRO MECH81SAMSUNG ELECTRONICS CO LTD33KO YOUNG GWAN10AHN SEOK HWAN2IBULE PHOTONICS CO LTD1
Top patents by PatentIndex Score
129 records- 0199US10109588B2Electronic component package and package-on-package structure including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 23, 2018·94 cites·29 claims
- 0298US10727212B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 28, 2020·36 cites·32 claims
- 0397US10026668B1Passivation layer having an opening for under bump metallurgySAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·26 cites·18 claims
- 0496US11676907B2Semiconductor package and antenna module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·4 cites·20 claims
- 0596US10665535B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 26, 2020·17 cites·22 claims
- 0696US10170386B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 1, 2019·40 cites·12 claims
- 0795US10062652B2Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 28, 2018·12 cites·18 claims
- 0894US9984979B2Fan-out semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted May 29, 2018·10 cites·34 claims
- 0993US10446478B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·12 cites·20 claims
- 1093US10403579B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 3, 2019·8 cites·16 claims
- 1192US10256200B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 9, 2019·7 cites·20 claims
- 1292US10199337B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 5, 2019·9 cites·2 claims
- 1390US9842789B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 12, 2017·7 cites·12 claims
- 1489US9832866B2Multilayered substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 28, 2017·7 cites·7 claims
- 1589US9741630B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 22, 2017·5 cites·25 claims
- 1688US11189552B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 30, 2021·2 cites·20 claims
- 1788US10362667B2Circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 23, 2019·4 cites·4 claims
- 1888US10262949B2Fan-out semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 16, 2019·4 cites·40 claims
- 1988US9999131B2Printed circuit board with embedded electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·6 cites·11 claims
- 2087US10573613B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 25, 2020·5 cites·21 claims
- 2186US10388614B2Fan-out semiconductor package and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 20, 2019·4 cites·18 claims
- 2285US10811328B1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Oct 20, 2020·4 cites·20 claims
- 2385US9837343B2Chip embedded substrateSAMSUNG ELECTRO MECH·Filed 2015·Granted Dec 5, 2017·5 cites·5 claims
- 2485US8196293B2Method of manufacturing a printed circuit boardKO YOUNG GWAN·Filed 2009·Granted Jun 12, 2012·10 cites·14 claims
- 2584US10410961B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·4 cites·24 claims
- 2684US10102964B2Coil electronic component and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 16, 2018·2 cites·9 claims
- 2784US9736927B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 15, 2017·4 cites·9 claims
- 2883US10985127B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 20, 2021·3 cites·15 claims
- 2983US10438884B2Carrier substrate and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·3 cites·14 claims
- 3082US8072052B2Trench substrateKO YOUNG GWAN·Filed 2009·Granted Dec 6, 2011·6 cites·8 claims
- 3181US10916495B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 9, 2021·3 cites·16 claims
- 3281US10522497B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·3 cites·26 claims
- 3381US10306778B2Printed circuit board with dam around cavity and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2016·Granted May 28, 2019·3 cites·20 claims
- 3480US10522451B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·2 cites·20 claims
- 3580US10475748B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·3 cites·22 claims
- 3680US9736939B2Printed circuit board and method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 15, 2017·3 cites·19 claims
- 3779US9832856B2Circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Nov 28, 2017·3 cites·8 claims
- 3879US9578749B2Element embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Feb 21, 2017·3 cites·14 claims
- 3978US12148708B2Semiconductor package and antenna module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·20 claims
- 4078US10045444B2Printed circuit board, package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Aug 7, 2018·3 cites·18 claims
- 4178US10002811B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 19, 2018·2 cites·25 claims
- 4277US9793250B2Package board, method for manufacturing the same and package on package having the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 17, 2017·3 cites·10 claims
- 4377US9655229B2Circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted May 16, 2017·2 cites·18 claims
- 4476US11158579B2Semiconductor package including a backside redistribution layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·2 cites·17 claims
- 4574US10475776B2Fan-out semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·2 cites·28 claims
- 4674US10115648B2Fan-out semiconductor package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 30, 2018·2 cites·22 claims
- 4774US8729406B2Method of fabricating a printed circuit boardKO YOUNG GWAN·Filed 2009·Granted May 20, 2014·4 cites·7 claims
- 4873US11062999B2Semiconductor package and antenna module comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 13, 2021·1 cites·20 claims
- 4973US10796997B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 6, 2020·2 cites·17 claims
- 5073US9699885B2Circuit board including heat dissipation structureSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 4, 2017·2 cites·17 claims
Showing the top 50 of 129 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →