Inventor · disambiguated record
Kwang Ok Jeong
Also filed as: JEONG KWANG-OK
8 granted patents·7 pending applications·47 citations·filing 2002–2021
84Inventor score
Top patents by PatentIndex Score
15 records- 0193US10446478B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 15, 2019·12 cites·20 claims
- 0291US9098670B2Double patterning layout design methodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 4, 2015·16 cites·7 claims
- 0390US10811352B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 20, 2020·9 cites·16 claims
- 0481US10916495B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 9, 2021·3 cites·16 claims
- 0567US11699643B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·12 claims
- 0666US10340263B2Integrated circuit for reducing ohmic drop in power railsSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jul 2, 2019·2 cites·18 claims
- 0753US2010006446A1Method for manufacturing package on package with cavitySAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 0849US6861887B2Clocked-scan flip-flop for multi-threshold voltage CMOS circuitSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 1, 2005·5 cites·17 claims
- 0949US2007199735A1Printed circuit board having inner via hole and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1048US2013140074A1Via hole plating method and printed circuit board manufactured using the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1147US10817637B2System and method of designing integrated circuit by considering local layout effectSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 27, 2020·0 cites·16 claims
- 1241US2012123574A1Plating method of substrate and manufacturing method of circuit board using the sameMOON JEONG-HO·Filed 2011·Application pending·0 cites
- 1337US2012031550A1Method for forming a plating layer and method for manufacturing a circuit board using the sameMOON JEONG-HO·Filed 2011·Application pending·0 cites
- 1437US2017262557A1Method of analyzing semiconductor devices and analysis apparatus for semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1536US2017344692A1Computer-implemented method of designing an integrated circuitSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →