Inventor · disambiguated record
Hongcheng Yin
Also filed as: YIN HONGCHENG
3 granted patents·3 citations·filing 2020–2021
52Inventor score
Files withHUAWEI TECH CO LTD3
Top patents by PatentIndex Score
3 records- 0187US11489247B2Integrated circuit and terminal deviceHUAWEI TECH CO LTD·Filed 2021·Granted Nov 1, 2022·3 cites·24 claims
- 0249US11462817B2Packaging structureHUAWEI TECH CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 0348US11251136B2Flip-chip die package structure and electronic deviceHUAWEI TECH CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →