Inventor · disambiguated record
Osvaldo Jorge Lopez
Also filed as: LOPEZ OSVALDO · LOPEZ OSVALDO J · LOPEZ OSVALDO JORGE
62 granted patents·12 pending applications·598 citations·filing 1993–2024
98Inventor score
Files withTEXAS INSTRUMENTS INC47HERBSOMMER JUAN A8ANADIGICS INC4AGERE SYSTEMS INC3CICLON SEMICONDUCTOR DEVICE CO3
Top patents by PatentIndex Score
74 records- 0198US9214415B2Integrating multi-output power converters having vertically stacked semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 15, 2015·41 cites·16 claims
- 0297US9373571B2Integrating multi-output power converters having vertically stacked semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 21, 2016·19 cites·9 claims
- 0396US6937102B2Low bias current/temperature compensation current mirror for linear power amplifierANADIGICS INC·Filed 2002·Granted Aug 30, 2005·90 cites·16 claims
- 0495US8304903B2Wirebond-less semiconductor packageHERBSOMMER JUAN A·Filed 2010·Granted Nov 6, 2012·21 cites·7 claims
- 0593US8910369B2Fabricating a power supply converter with load inductor structured as heat sinkTEXAS INSTRUMENTS INC·Filed 2014·Granted Dec 16, 2014·16 cites·2 claims
- 0692US11784114B2Plated metal layer in power packagesTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 0791US8431979B2Power converter having integrated capacitorHERBSOMMER JUAN A·Filed 2011·Granted Apr 30, 2013·14 cites·18 claims
- 0890US9935041B1Multi-chip module clips with connector barTEXAS INSTRUMENTS INC·Filed 2017·Granted Apr 3, 2018·7 cites·11 claims
- 0990US8049312B2Semiconductor device package and method of assembly thereofCICLON SEMICONDUCTOR DEVICE CORP·Filed 2009·Granted Nov 1, 2011·24 cites·5 claims
- 1089US11177197B2Semiconductor package with solder standoffTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 16, 2021·5 cites·24 claims
- 1189US7166496B1Method of making a packaged semiconductor deviceCICLON SEMICONDUCTOR DEVICE CO·Filed 2005·Granted Jan 23, 2007·56 cites·22 claims
- 1287US8546925B2Synchronous buck converter having coplanar array of contact bumps of equal volumeHERBSOMMER JUAN A·Filed 2011·Granted Oct 1, 2013·10 cites·15 claims
- 1387US6580321B1Active clamping circuit for power amplifiersANADIGICS INC·Filed 2001·Granted Jun 17, 2003·47 cites·35 claims
- 1486US6559722B1Low bias current/temperature compensation current mirror for linear power amplifierANADIGICS INC·Filed 2000·Granted May 6, 2003·31 cites·16 claims
- 1586US6514698B1DNA methyltransferase genotypingFiled 2000·Granted Feb 4, 2003·29 cites·48 claims
- 1685US9305852B1Silicon package for embedded electronic system having stacked semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 5, 2016·6 cites·13 claims
- 1784US10050025B2Power converter monolithically integrating transistors, carrier, and componentsTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 14, 2018·4 cites·10 claims
- 1884US7504733B2Semiconductor die packageCICLON SEMICONDUCTOR DEVICE CO·Filed 2005·Granted Mar 17, 2009·11 cites·22 claims
- 1983US9305872B2DC-DC converter having terminals of semiconductor chips directly attachable to circuit boardTEXAS INSTRUMENTS INC·Filed 2015·Granted Apr 5, 2016·3 cites·8 claims
- 2082US9184121B2Stacked synchronous buck converter having chip embedded in outside recess of leadframeTEXAS INSTRUMENTS INC·Filed 2014·Granted Nov 10, 2015·9 cites·20 claims
- 2182US8354303B2Thermally enhanced low parasitic power semiconductor packageTEXAS INSTRUMENTS INC·Filed 2009·Granted Jan 15, 2013·8 cites·12 claims
- 2281US11658130B2Conductive plate stress reduction featureTEXAS INSTRUMENTS INC·Filed 2020·Granted May 23, 2023·1 cites·30 claims
- 2380US9508633B2High performance power transistor having ultra-thin packageHERBSOMMER JUAN A·Filed 2011·Granted Nov 29, 2016·5 cites·10 claims
- 2479US9543240B2DC-DC converter having terminals of semiconductor chips directly attachable to circuit boardTEXAS INSTRUMENTS INC·Filed 2016·Granted Jan 10, 2017·2 cites·8 claims
- 2578US12406915B2Plated metal layer in power packagesTEXAS INSTRUMENTS INC·Filed 2023·Granted Sep 2, 2025·0 cites·23 claims
- 2677US8760872B2DC-DC converter vertically integrated with load inductor structured as heat sinkHERBSOMMER JUAN A·Filed 2011·Granted Jun 24, 2014·3 cites·3 claims
- 2777US5428837AMethod and apparatus for reducing local oscillator leakage in integrated circuit receiversANADIGICS INC·Filed 1993·Granted Jun 27, 1995·47 cites·9 claims
- 2876US9425132B2Stacked synchronous buck converter having chip embedded in outside recess of leadframeTEXAS INSTRUMENTS INC·Filed 2015·Granted Aug 23, 2016·2 cites·10 claims
- 2976US6956437B2Metal-oxide-semiconductor device having integrated bias circuitAGERE SYSTEMS INC·Filed 2003·Granted Oct 18, 2005·26 cites·15 claims
- 3076US6111079ALead binding polypeptides and nucleotides coding thereforeBIONEBRASKA INC·Filed 1996·Granted Aug 29, 2000·28 cites·19 claims
- 3175US12243809B2Packaged electronic device with film isolated power stackTEXAS INSTRUMENTS INC·Filed 2023·Granted Mar 4, 2025·0 cites·17 claims
- 3274US9171828B2DC-DC converter having terminals of semiconductor chips directly attachable to circuit boardTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 27, 2015·2 cites·4 claims
- 3374US7433192B2Packaging for electronic modulesAGERE SYSTEMS INC·Filed 2005·Granted Oct 7, 2008·7 cites·5 claims
- 3474US7215204B2Intelligent high-power amplifier moduleAGERE SYSTEMS INC·Filed 2005·Granted May 8, 2007·7 cites·22 claims
- 3573US10438936B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 8, 2019·1 cites·5 claims
- 3671US9721860B2Silicon package for embedded semiconductor chip and power converterTEXAS INSTRUMENTS INC·Filed 2014·Granted Aug 1, 2017·2 cites·9 claims
- 3769US11908780B2Semiconductor package with solder standoffTEXAS INSTRUMENTS INC·Filed 2021·Granted Feb 20, 2024·0 cites·24 claims
- 3869US10062624B2Silicon package for embedded semiconductor chip and power converterTEXAS INSTRUMENTS INC·Filed 2017·Granted Aug 28, 2018·1 cites·8 claims
- 3968US11640932B2Packaged electronic device with film isolated power stackTEXAS INSTRUMENTS INC·Filed 2021·Granted May 2, 2023·0 cites·20 claims
- 4066US11930590B2Stress relief for flip-chip packaged devicesTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 12, 2024·0 cites·12 claims
- 4166US9779967B2Ultra-thin power transistor and synchronous buck converter having customized footprintTEXAS INSTRUMENTS INC·Filed 2015·Granted Oct 3, 2017·1 cites·11 claims
- 4263US9165865B2Ultra-thin power transistor and synchronous buck converter having customized footprintHERBSOMMER JUAN A·Filed 2011·Granted Oct 20, 2015·1 cites·10 claims
- 4363US9076891B2Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layerTEXAS INSTRUMENTS INC·Filed 2013·Granted Jul 7, 2015·1 cites·20 claims
- 4462US11177246B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 16, 2021·0 cites·22 claims
- 4559US11024564B2Packaged electronic device with film isolated power stackTEXAS INSTRUMENTS INC·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 4658US2025279401A1Integrated module having a thermal networkTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 4756US10930582B2Semiconductor device having terminals directly attachable to circuit boardTEXAS INSTRUMENTS INC·Filed 2016·Granted Feb 23, 2021·0 cites·21 claims
- 4856US9859261B2Photo-sensitive silicon package embedding self-powered electronic systemTEXAS INSTRUMENTS INC·Filed 2017·Granted Jan 2, 2018·0 cites·6 claims
- 4956US2023411262A1Microelectronics device package and methodsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 5055US9653388B2Integrating multi-output power converters having vertically stacked semiconductor chipsTEXAS INSTRUMENTS INC·Filed 2015·Granted May 16, 2017·0 cites·20 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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