Inventor · disambiguated record
Haruo Murakami
Also filed as: MURAKAMI HARUO
3 granted patents·1 pending application·19 citations·filing 1992–2010
62Inventor score
Top patents by PatentIndex Score
4 records- 0173US8969490B2Epoxy resin composition, resin sheet, prepreg, multilayer printed wiring board and semiconductor deviceOHIGASHI NORIYUKI·Filed 2009·Granted Mar 3, 2015·3 cites·20 claims
- 0249US5369569ASystem for restoring controlled unit from abnormal conditionNIPPON DENSO CO·Filed 1992·Granted Nov 29, 1994·16 cites·10 claims
- 0337US8535782B2Resin sheet for circuit board and production process thereforMURAKAMI HARUO·Filed 2008·Granted Sep 17, 2013·0 cites·40 claims
- 0435US2012111621A1Resin composition, resin sheet, prepreg, metal-clad laminate, printed wiring board and semiconductor deviceOHIGASHI NORIYUKI·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →