Inventor · disambiguated record
Seiji Fukae
Also filed as: FUKAE SEIJI
2 granted patents·3 citations·filing 2009–2012
42Inventor score
Technology areasH10W
Files withYONEDA SHUJI2
Top patents by PatentIndex Score
2 records- 0162US8153467B2Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture and method for manufacturing sameYONEDA SHUJI·Filed 2009·Granted Apr 10, 2012·3 cites·4 claims
- 0246US8525285B2Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufactureYONEDA SHUJI·Filed 2012·Granted Sep 3, 2013·0 cites·8 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →