Inventor · disambiguated record

Bun-Hin Keong

Also filed as: KEONG BUN-HIN

2 granted patents·9 citations·filing 2004–2006

54Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG2

Top patents by PatentIndex Score

2 records

0164US7615410B2Chip-sized flip-chip semiconductor package and method for making the sameINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 10, 2009·5 cites·15 claims
0243US7432584B2Leadframe for use in a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 7, 2008·4 cites·10 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →