Inventor · disambiguated record
Wenjun Tian
Also filed as: TIAN WENJUN
8 granted patents·1 pending application·8 citations·filing 2013–2017
77Inventor score
Top patents by PatentIndex Score
9 records- 0188US9447238B2Polyphenylene oxide resin, method of preparing polyphenylene oxide resin, polyphenylene oxide prepolymer and resin compositionELITE ELECTRONIC MAT (KUNSHAN) CO LTD·Filed 2015·Granted Sep 20, 2016·3 cites·13 claims
- 0282US9469757B2Low dissipation factor resin composition and product made therebyELITE ELECTRONIC MAT (KUNSHAN) CO LTD·Filed 2015·Granted Oct 18, 2016·2 cites·6 claims
- 0373US9850375B2Resin composition, copper clad laminate and printed circuit board using sameELITE ELECTRONIC MAT (KUNSHAN) CO LTD·Filed 2013·Granted Dec 26, 2017·1 cites·15 claims
- 0471US9402310B2Low-dielectric resin composition and copper-clad laminate and printed circuit board using the sameELITE ELECTRONIC MAT (KUNSHAN) CO LTD·Filed 2014·Granted Jul 26, 2016·2 cites·10 claims
- 0557US9574070B2Aromatic tetrafunctional vinylbenzyl resin composition and use thereofELITE ELECTRONIC MAT (KUNSHAN) CO LTD·Filed 2015·Granted Feb 21, 2017·0 cites·10 claims
- 0656US10072148B2Resin composition, copper clad laminate and printed circuit board using sameELITE ELECTRONIC MAT KUNSHAN CO LTD·Filed 2017·Granted Sep 11, 2018·0 cites·11 claims
- 0754US9131607B2Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the sameELITE ELECTRONIC MATERIAL KUNSHAN CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·8 claims
- 0851US9650512B2Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the sameELITE ELECTRONIC MAT (KUNSHAN) CO LTD·Filed 2013·Granted May 16, 2017·0 cites·8 claims
- 0938US2014113118A1Halogen-free resin composition and application thereofELITE ELECTRONIC MATERIAL KUNSHAN CO LTD·Filed 2013·Application pending·0 cites
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