Inventor · disambiguated record
Sehwan Hong
Also filed as: HONG SEHWAN
3 granted patents·2 pending applications·7 citations·filing 2018–2024
61Inventor score
Top patents by PatentIndex Score
5 records- 0186US10672715B2Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 2, 2020·6 cites·18 claims
- 0279US2025105165A1Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0377US11410935B2Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 9, 2022·1 cites·20 claims
- 0471US12165986B2Semiconductor package using cavity substrate and manufacturing methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 0555US2024198604A1Film adhesion apparatus for a housing of an electronic apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →