Inventor · disambiguated record
Tatsuo Enomoto
Also filed as: ENOMOTO TATSUO
10 granted patents·35 citations·filing 1991–2018
83Inventor score
Top patents by PatentIndex Score
10 records- 0189US9728442B2Workpiece holding apparatusSHINETSU HANDOTAI KK·Filed 2015·Granted Aug 8, 2017·9 cites·2 claims
- 0264US7902042B2Method of manufacturing SOI wafer and thus-manufactured SOI waferSHINETSU HANDOTAI KK·Filed 2005·Granted Mar 8, 2011·2 cites·15 claims
- 0361US9931730B2Automatic handling apparatus with positioning pinsSHINETSU HANDOTAI KK·Filed 2015·Granted Apr 3, 2018·1 cites·3 claims
- 0461US9050698B2Manufacturing method of carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and double-side polishing method of waferYASUDA TAICHI·Filed 2010·Granted Jun 9, 2015·3 cites·8 claims
- 0560US11584037B2Wire saw apparatus and method for manufacturing waferSHINETSU HANDOTAI KK·Filed 2018·Granted Feb 21, 2023·0 cites·2 claims
- 0645US10166649B2Machining apparatus for workpieceSHINETSU HANDOTAI KK·Filed 2015·Granted Jan 1, 2019·0 cites·10 claims
- 0744US10236191B2Wafer drying apparatus and method for drying a waferSHINETSU HANDOTAI KK·Filed 2014·Granted Mar 19, 2019·0 cites·7 claims
- 0844US5211794AWafer etching apparatusSHINETSU HANDOTAI KK·Filed 1991·Granted May 18, 1993·20 cites·7 claims
- 0943US10434621B2Workpiece processing apparatus and workpiece processing methodSHINETSU HANDOTAI KK·Filed 2015·Granted Oct 8, 2019·0 cites·6 claims
- 1033US10730161B2Method for conditioning polishing pad and polishing apparatusSHINETSU HANDOTAI KK·Filed 2016·Granted Aug 4, 2020·0 cites·2 claims
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