Inventor · disambiguated record
John Persic
Also filed as: PERSIC JOHN · PERSIC JOHN I
3 granted patents·9 pending applications·50 citations·filing 2002–2022
64Inventor score
Top patents by PatentIndex Score
12 records- 0182US6896170B2Wire bonder for ball bonding insulated wire and method of using sameMICROBONDS INC·Filed 2002·Granted May 24, 2005·48 cites·19 claims
- 0265US12342824B2Metal-infused antimicrobial material and method of preparation thereofMICROBONDS INC·Filed 2021·Granted Jul 1, 2025·0 cites·22 claims
- 0359US2023147489A1Systems and methods for physiology monitoring garmentMYANT INC·Filed 2022·Application pending·0 cites
- 0450US2021329924A1Metal-based antimicrobial composition and method of usingMICROBONDS INC·Filed 2020·Application pending·0 cites
- 0549US2022117553A1Systems and methods for physiology monitoring garmentMYANT INC·Filed 2020·Application pending·0 cites
- 0646US2021204877A1Textile computing platform in sleeve formMYANT INC·Filed 2019·Application pending·0 cites
- 0746US2023284714A1Adaptive personal protective facial garments and methods of operating the sameMYANT INC·Filed 2021·Application pending·0 cites
- 0836US2008048344A1High performance ic package and methodLYN ROBERT·Filed 2007·Application pending·0 cites
- 0935US7360675B2Wire bonder for ball bonding insulated wire and method of using sameMICROBONDS INC·Filed 2004·Granted Apr 22, 2008·2 cites·9 claims
- 1035US2015322586A1Bonding wire and process for manufacturing a bonding wireMICROBONDS INC·Filed 2012·Application pending·0 cites
- 1135US2007262119A1Wire bonding process for insulated wiresRAMKUMAR MALLIAH·Filed 2007·Application pending·0 cites
- 1234US2006175712A1High performance IC package and methodMICROBONDS INC·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →