Inventor · disambiguated record
Chang-Chia Huang
Also filed as: HUANG CHANG-CHIA
34 granted patents·2 pending applications·169 citations·filing 2011–2024
96Inventor score
Files withAPPLE INC13TAIWAN SEMICONDUCTOR MFG CO LTD12TAIWAN SEMICONDUCTOR MFG5HUANG CHANG-CHIA2CHUANG YAO-CHUN1
Top patents by PatentIndex Score
36 records- 0199US9613931B2Fan-out stacked system in package (SIP) having dummy dies and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·64 cites·19 claims
- 0298US11527502B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·4 cites·20 claims
- 0397US11901320B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·2 cites·20 claims
- 0497US9105530B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 11, 2015·22 cites·20 claims
- 0593US12087187B2Electronic devices with deformation-resistant displaysAPPLE INC·Filed 2022·Granted Sep 10, 2024·6 cites·23 claims
- 0693US9691686B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 27, 2017·10 cites·20 claims
- 0790US9953939B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·4 cites·20 claims
- 0888US9978656B2Mechanisms for forming fine-pitch copper bump structuresLIN TSUNG SHU·Filed 2012·Granted May 22, 2018·12 cites·20 claims
- 0988US9786520B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·5 cites·20 claims
- 1087US12429907B2Electronic devices with flexible display cover layersAPPLE INC·Filed 2024·Granted Sep 30, 2025·0 cites·18 claims
- 1187US8987915B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 24, 2015·8 cites·20 claims
- 1286US11402868B2Hybrid coverlay/window structure for flexible display applicationsAPPLE INC·Filed 2020·Granted Aug 2, 2022·2 cites·16 claims
- 1385US10817016B2Hybrid coverlay/window structure for flexible display applicationsAPPLE INC·Filed 2019·Granted Oct 27, 2020·4 cites·22 claims
- 1484US10930605B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 23, 2021·2 cites·20 claims
- 1582US11991901B2Electronic devices with flexible display cover layersAPPLE INC·Filed 2023·Granted May 21, 2024·0 cites·20 claims
- 1682US11442503B2Wearable bands with embedded circuitryAPPLE INC·Filed 2018·Granted Sep 13, 2022·3 cites·16 claims
- 1781US9583367B2Methods and apparatus for bump-on-trace chip packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·3 cites·20 claims
- 1880US11647648B2Electronic devices with flexible display cover layersAPPLE INC·Filed 2022·Granted May 9, 2023·0 cites·6 claims
- 1978US9449933B2Packaging device and method of making the sameHUANG CHANG-CHIA·Filed 2012·Granted Sep 20, 2016·5 cites·19 claims
- 2077US8922006B2Elongated bumps in integrated circuit devicesLIN YEN-LIANG·Filed 2012·Granted Dec 30, 2014·5 cites·18 claims
- 2174US12213267B2Electronic devices having folding expandable displaysAPPLE INC·Filed 2020·Granted Jan 28, 2025·1 cites·18 claims
- 2273US11846984B2Hybrid coverlay/window structure for flexible display applicationsAPPLE INC·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 2371US9165796B2Methods and apparatus for bump-on-trace chip packagingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 20, 2015·2 cites·20 claims
- 2470US9209046B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·2 cites·15 claims
- 2569US8476759B2Electrical connection structureCHUANG YAO-CHUN·Filed 2011·Granted Jul 2, 2013·2 cites·14 claims
- 2665US12115771B2Electronic devices with multilayer adhesiveAPPLE INC·Filed 2022·Granted Oct 15, 2024·0 cites·29 claims
- 2761US11444268B2Electronic devices with flexible display cover layersAPPLE INC·Filed 2020·Granted Sep 13, 2022·0 cites·12 claims
- 2861US8866285B2Fan-out package comprising bulk metalHU YEN-CHANG·Filed 2012·Granted Oct 21, 2014·1 cites·19 claims
- 2960US11961946B2Electronic devices with flexible displaysAPPLE INC·Filed 2021·Granted Apr 16, 2024·0 cites·22 claims
- 3059US10700033B2Packaging device and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 30, 2020·0 cites·20 claims
- 3159US10453813B2Contact pad for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 22, 2019·0 cites·20 claims
- 3258US9508668B2Conductive contacts having varying widths and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 29, 2016·0 cites·20 claims
- 3356US2025120026A1Electronic Devices Having Folding Expandable DisplaysAPPLE INC·Filed 2024·Application pending·0 cites
- 3455US10050001B2Packaging device and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
- 3553US8883628B2Electrical connection structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 11, 2014·0 cites·17 claims
- 3636US2013277828A1Methods and Apparatus for bump-on-trace Chip PackagingHUANG CHANG-CHIA·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →