Inventor · disambiguated record
Yu-Chih Liu
Also filed as: LIU YU · LIU YU-CHIH
62 granted patents·14 pending applications·269 citations·filing 2003–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD26BEIJING BOE OPTOELECTRONICS TECH CO LTD6BOE TECHNOLOGY GROUP CO LTD6ZTE CORP5ASUSTEK COMP INC2
Top patents by PatentIndex Score
76 records- 0196US10163754B2Lid design for heat dissipation enhancement of die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 25, 2018·31 cites·20 claims
- 0295US9735043B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·20 claims
- 0393US9812410B2Lid structure for a semiconductor device package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·7 cites·20 claims
- 0493US6793539B1Linking apparatus for stackable network devicesACCTON TECHNOLOGY CORP·Filed 2003·Granted Sep 21, 2004·72 cites·13 claims
- 0592US9673119B2System and method for bonding package lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 6, 2017·10 cites·20 claims
- 0691US9349663B2Package-on-package structure having polymer-based material for warpage controlCHEN MENG-TSE·Filed 2012·Granted May 24, 2016·9 cites·20 claims
- 0791US8288208B1Apparatus and methods for semiconductor packages with improved warpageLIU YU-CHIH·Filed 2011·Granted Oct 16, 2012·17 cites·15 claims
- 0890US11665531B2End to end troubleshooting of mobility servicesAT & T IP I LP·Filed 2020·Granted May 30, 2023·3 cites·20 claims
- 0990US8916419B2Lid attach process and apparatus for fabrication of semiconductor packagesCHEN CHIN-LIANG·Filed 2012·Granted Dec 23, 2014·11 cites·20 claims
- 1089US10157863B2Method for forming a lid structure for a semiconductor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·4 cites·20 claims
- 1188US9786520B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·5 cites·20 claims
- 1286US11417643B2Package-on-package with redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 16, 2022·3 cites·20 claims
- 1384US9627355B2Package-on-package structure having polymer-based material for warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·3 cites·20 claims
- 1483US9887144B2Ring structure for chip packagingLIN WEN YI·Filed 2011·Granted Feb 6, 2018·7 cites·20 claims
- 1583US9287233B2Adhesive pattern for advance package reliability improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 15, 2016·6 cites·19 claims
- 1683US8593471B2Memory access method and access controller for a memoryHUANG JUN·Filed 2011·Granted Nov 26, 2013·5 cites·20 claims
- 1782US8652939B2Method and apparatus for die assemblySUNG MING-CHUNG·Filed 2011·Granted Feb 18, 2014·6 cites·14 claims
- 1880US10157772B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·2 cites·20 claims
- 1978US8150210B2Image synthesis system for a vehicle and the manufacturing method thereofCHEN YONG-SHENG·Filed 2008·Granted Apr 3, 2012·19 cites·20 claims
- 2077US10921660B2Circuit board, display panel and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2017·Granted Feb 16, 2021·1 cites·8 claims
- 2176US10775167B2Sensing single mode optical fiber, tilt angle sensor and preparation method thereofBOE TECHNOLOGY GROUP CO LTD·Filed 2018·Granted Sep 15, 2020·2 cites·16 claims
- 2275US9793242B2Packages with die stack including exposed molding underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 17, 2017·3 cites·20 claims
- 2374US9666556B2Flip chip packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·2 cites·20 claims
- 2473US9893043B2Method of manufacturing a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 13, 2018·3 cites·20 claims
- 2571US11972956B2Lid attach process and dispenser headTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 30, 2024·0 cites·24 claims
- 2670US9209046B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 8, 2015·2 cites·15 claims
- 2769US9142523B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·2 cites·20 claims
- 2868US9805997B2Packaging methods for semiconductor devices with encapsulant ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 31, 2017·2 cites·19 claims
- 2965US9147584B2Rotating curingLU JING RUEI·Filed 2011·Granted Sep 29, 2015·2 cites·19 claims
- 3064US10825807B2Electrostatic protection circuit, array substrate, display panel and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2017·Granted Nov 3, 2020·1 cites·17 claims
- 3162US11133285B2Package-on-package structure having polymer-based material for warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 3262US10199400B2Array substrate, display panel and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2016·Granted Feb 5, 2019·1 cites·11 claims
- 3362US8664039B2Methods and apparatus for alignment in flip chip bondingSUNG MING-CHUNG·Filed 2011·Granted Mar 4, 2014·1 cites·17 claims
- 3460US10879140B2System and method for bonding package lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
- 3560US10867835B2Semiconductor packaging structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·20 claims
- 3659US11112423B2Acceleration sensorBEIJING BOE OPTOELECTRONICS TECH CO LTD·Filed 2019·Granted Sep 7, 2021·0 cites·19 claims
- 3759US9502373B2Lid attach process and apparatus for fabrication of semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·0 cites·20 claims
- 3859US2024057173A1Method, device, and system for small data transmission in wireless networksZTE CORP·Filed 2023·Application pending·0 cites
- 3959US2023379126A1Method, device, and system for small data transmission in wireless networksZTE CORP·Filed 2023·Application pending·0 cites
- 4058US11988921B1Light boards, methods of manufacturing a light board, and spliced display devicesTCL CHINA STAR OPTOELECTRONICS TECH CO LTD·Filed 2023·Granted May 21, 2024·0 cites·18 claims
- 4158US10269763B2Package-on-package structure having polymer-based material for warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 4258US9191439B2Method and system for data synchronization in content delivery networkLIU HAO·Filed 2010·Granted Nov 17, 2015·1 cites·18 claims
- 4358US2024098797A1Systems and methods for managing small data transmissionsZTE CORP·Filed 2023·Application pending·0 cites
- 4457US10685853B2Lid attach processes for semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 16, 2020·0 cites·20 claims
- 4557US10515941B2Methods of forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
- 4657US10269668B2System and method for bonding package lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 4757US9859265B2Package structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 2, 2018·0 cites·20 claims
- 4854US2025261247A1Wireless communication methods for random access channels, apparatus, and computer-readable mediumZTE CORP·Filed 2025·Application pending·0 cites
- 4952US11408908B2Fiber optic sensor, manufacturing method thereof and motion sensing deviceBEIJING BOE OPTOELECTRONICS TECH CO LTD·Filed 2019·Granted Aug 9, 2022·0 cites·20 claims
- 5051US7355930B2Method of opening/closing a disk tray in a disk driveULEAD SYSTEMS INC·Filed 2003·Granted Apr 8, 2008·1 cites·10 claims
Showing the top 50 of 76 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →